Multilayer Ceramic Component Electrode Glass Exposure Control
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Solution Overview
Problem
Multilayer ceramic electronic components with conductive resin layers are prone to cracking under increased bending due to exposure of glass at the interface between the underlying electrode layer and the conductive resin layer.
Innovation Solution
The multilayer ceramic electronic component design includes underlying electrode layers with sintered metal and glass, where the maximum exposure length of glass at the interface with the conductive resin layer is limited to 3.8 μm or less and the exposure rate is 10.1% or less, enhancing the substrate's bending resistance and preventing cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass is added to the underlying electrode layer to decrease baking temperature and enhance close-contact strength, then sintering temperature is reduced and bonding strength is improved, but cracks occur in the ceramic element assembly under bending stress
Solution Approach 1:
The patent changes the physical parameters of the glass particles, specifically controlling the maximum particle size to 10 μm or less and the average particle size to 5 μm or less. This parameter optimization allows the glass to maintain its beneficial effects on sintering and bonding while minimizing its harmful effect of causing cracks under bending stress.
Solution Approach 2:
The patent applies local quality by creating a dual-layer glass structure: a first glass layer with larger particles (maximum size not exceeding 10 μm) for overall bonding, and a second glass layer with smaller particles (maximum size not exceeding 5 μm) specifically at the interface with the conductive resin layer. This localized refinement prevents crack initiation at the critical interface while maintaining bonding strength throughout the electrode layer.
2Strength
If glass is exposed at the interface between the underlying electrode layer and the conductive resin layer, then close-contact strength is enhanced, but the exposure of glass creates starting points for cracks under bending
Solution Approach 1:
The patent changes the size parameters of glass particles at the critical interface, limiting maximum size to 10 μm and average size to 5 μm or less. This size reduction eliminates the glass exposure that acts as crack initiation sites while preserving the close-contact strength function.
Solution Approach 2:
The patent implements local quality by creating a second glass layer with specifically controlled smaller particle sizes (maximum 5 μm) at the interface region between the underlying electrode layer and conductive resin layer. This localized particle size refinement ensures that glass particles at this critical interface do not protrude or expose, thereby preventing crack initiation while maintaining bonding strength.
3Strength
If the conductive resin layer is used to improve bending strength and impact resistance, then mechanical durability is enhanced, but the interface with glass-containing underlying electrode layer becomes a weak point for crack formation
Solution Approach 1:
The patent applies local quality by creating a second glass layer with smaller particles (maximum size not exceeding 5 μm) specifically at the interface between the underlying electrode layer and conductive resin layer. This localized particle size control ensures smooth interface formation that is compatible with the conductive resin layer, preventing stress concentration and crack initiation at this critical boundary while maintaining the overall bending strength enhancement provided by the conductive resin layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases the bending resistance of the multilayer ceramic components, reducing the occurrence of cracks even under significant bending stress, thereby improving their durability and reliability.
Implementation Method 1
The underlying electrode layer is disposed between the conductive resin layer and the ceramic element assembly and contains a sintered metal and glass. The glass is contained for the purpose of decreasing the baking temperature (sintering aid) and enhancing the close-contact strength with respect to the ceramic element assembly.
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic element assembly and outer electrodes provided on respective end surfaces of the ceramic element assembly. Each outer electrode includes an underlying electrode layer that is provided on the ceramic element assembly and that includes a sintered metal and glass and a conductive resin layer that is provided on the underlying electrode layer and that includes a metal filler and a resin. The underlying electrode layer satisfies at least one condition of a condition that a maximum exposure length of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 3.8 μm or less and a condition that an exposure rate of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 10.1% or less.