Laminated Ceramic Electronic Component with Internal Electrode Inside Conductive Layer
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Solution Overview
Problem
Conventional laminated ceramic electronic components face issues with high equivalent series resistance (ESR) and cracking due to the use of common ceramic materials in external electrodes, which affect their reliability and performance.
Innovation Solution
The electronic component design incorporates internal electrodes with end portions located inside the conductive layers, reducing the proportion of electrodes in the conductive layers and minimizing thermal shrinkage differences, thereby reducing cracks and lowering ESR. Additionally, auxiliary electrodes are positioned inside the conductive layers to enhance joint strength and connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the end portion of the internal electrode is positioned inside the conductive layer, then the ESR is reduced, but the proportion of internal electrode in the conductive layer increases which may cause cracks during firing
Solution Approach 1:
The patent applies local quality by creating different regions within the conductive layer: a first region where the internal electrode end portion is positioned inside the conductive layer (to reduce ESR), and a second region where the internal electrode end portion is positioned at the same level as the conductive layer surface (to prevent cracks). This spatial differentiation allows simultaneous optimization of both ESR and crack resistance in different locations.
2Loss of energy
If the internal electrode penetrates through the conductive layer, then the ESR is further reduced, but the difference in thermal shrinkage during firing increases which causes cracks
Solution Approach 1:
The patent applies partial action by having the internal electrode partially penetrate the conductive layer (with the end portion positioned inside) rather than completely penetrating through. This partial penetration achieves sufficient ESR reduction while limiting the thermal shrinkage difference that would occur with full penetration, thus preventing cracks.
3Strength
If auxiliary electrodes are positioned inside the conductive layer, then joint strength is enhanced, but the device complexity increases
Solution Approach 1:
The patent applies merging by integrating the auxiliary electrode with the internal electrode structure, where the auxiliary electrode is positioned inside the conductive layer in close proximity to the internal electrode end portion. This combined arrangement enhances joint strength while minimizing additional structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces or prevents cracks and achieves low ESR, enhancing the connection reliability and joint strength between the electronic component main body and external electrodes, while maintaining the structural integrity during firing.
Implementation Method 1
since the end portion of the first internal electrode is located inside the first conductive layer, a length of the first conductive layer between a surface of the first external electrode and the first internal electrode, and has relatively high electric resistance, is short. Thus, resistance between the first internal electrode and the surface of the first external electrode is low.
Implementation Method 2
a difference in thermal shrinkage during firing between the first conductive layer and the electronic component main body is increased. Thus, cracks are easily produced during firing.
Data Source
AI summary
An electronic component includes a first external electrode disposed on a first end surface and a second external electrode disposed on a second end surface. The first external electrode includes a first conductive layer including ceramic particles. The second external electrode includes a second conductive layer including ceramic particles. An end portion of a first internal electrode is located inside the first conductive layer. The electronic component includes little or no cracks and has a low equivalent series resistance (ESR).