Ceramic Electronic Component Electrode Formation via Laser and Plating
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Solution Overview
Problem
Existing methods for forming electrodes on ceramic electronic components are complex, costly, and limited in shape flexibility, as they require applying conductive paste and baking, or expose internal electrodes for plating, which complicates manufacturing and affects component properties.
Innovation Solution
A method involving local heating of the ceramic body to reduce resistance and facilitate plating of metal electrodes over the entire electrode formation region, allowing for flexible electrode shapes without the need for conductive paste application or exposing internal electrodes, using techniques like laser irradiation for efficient electrode formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive paste is applied and baked to form base electrodes, then electrodes can be formed on ceramic body, but manufacturing steps are complicated and cost increases
Solution Approach 1:
The patent extracts and eliminates the unnecessary conductive paste application and baking steps from the electrode formation process. By directly plating the ceramic body surface after simple preparation, the invention removes the complex multi-step paste-based process while maintaining electrode formation capability, thereby simplifying manufacturing and reducing costs.
Solution Approach 2:
The patent replaces the mechanical paste application and thermal baking process with an electrochemical plating process. Instead of applying paste mechanically and heating it, the invention uses electroless or electrolytic plating to directly deposit conductive metal layers on the ceramic surface, substituting a simpler chemical/electrical process for the complex mechanical-thermal process.
2Ease of manufacture
If conductive paste is applied by dip method, then electrodes can be formed, but applied shape is limited and paste wraps around side surfaces
Solution Approach 1:
The patent applies local quality by enabling selective electrode formation only on specific target areas of the ceramic body surface. Through localized plating techniques and masking methods, electrodes can be precisely deposited on end surfaces or side surfaces as needed, without unwanted deposition on adjacent surfaces. This provides shape flexibility and adaptability, allowing electrodes to be formed exactly where required without the wrapping effect of dip methods.
Solution Approach 2:
The patent changes the fundamental parameter of electrode formation from paste-based deposition to metal plating deposition. This parameter change enables precise control over electrode shape, size, and location through plating process parameters (current density, plating time, masking patterns), providing versatility in creating different electrode configurations without the shape limitations of dip coating.
3Ease of manufacture
If internal electrodes are exposed for plating, then external electrodes can be formed, but manufacturing steps are complicated and cost increases
Solution Approach 1:
The patent extracts and eliminates the requirement to expose internal electrodes for electrode formation. By plating the external surface of the ceramic body directly, the invention removes the complex steps of internal electrode exposure, alignment, and connection that are necessary in traditional methods, thereby simplifying manufacturing while maintaining electrode functionality.
Solution Approach 2:
The patent introduces a surface preparation layer or transition layer as an intermediary between the ceramic body surface and the conductive plating layer. This intermediary layer enables direct plating on the ceramic surface without needing to access internal electrodes, serving as a mediator that facilitates electrode formation through the ceramic body wall rather than through exposed internal structures.
4Ease of manufacture
If laser irradiation is used to burn off electrode, then coil pattern can be formed, but heat spreads to ferrite and changes properties adversely
Solution Approach 1:
The patent applies preliminary action by performing surface treatment or creating a specialized surface layer on the ceramic body before plating. This preliminary surface modification enables selective plating and better adhesion while allowing subsequent laser processing to affect only the electrode layer without harmful heat diffusion to the bulk ferrite, thereby protecting the ceramic properties from thermal damage.
Solution Approach 2:
The patent segments the ceramic body structure by creating a distinct surface layer or interface zone between the bulk ceramic and the electrode formation region. This segmentation allows laser irradiation to be confined to the electrode layer and surface region, preventing heat from spreading to and altering the properties of the bulk ferrite material, thus eliminating the harmful thermal effects while maintaining manufacturing flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the electrode formation process, reduces manufacturing costs, and enables the creation of electrodes on any surface, including complex shapes, without affecting the ceramic component's characteristics, allowing for high-density mounting and reduced risk of short circuits.
Implementation Method 1
locally heating an electrode formation region on a surface of the ceramic body to partially lower resistance of the ceramic body
Implementation Method 2
partially lower resistance of the ceramic body, thereby forming a low-resistance portion
Implementation Method 3
subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion
Data Source
AI summary
A manufacturing method that is capable of forming an electrode on any part of a surface of a sintered ceramic body in accordance with a simple approach, and a ceramic electronic component manufactured by the method. The method for manufacturing a ceramic electronic component includes steps of preparing a sintered ceramic body containing a metal oxide, irradiating an electrode formation region on a surface of the ceramic body with a laser to partially lower resistance of the ceramic body, thereby forming a low-resistance portion, and subjecting the ceramic body to plating to deposit a plated metal serving as an electrode on the low-resistance portion, and growing the plated metal to extend over the entire electrode formation region.