Multilayer Ceramic Component Electrode Structure for Moisture Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic electronic components face challenges in achieving improved moisture resistance, reliability, and mechanical strength between the ceramic element body and external electrodes, particularly due to residual stress and inadequate bonding.
Innovation Solution
The solution involves a multilayer ceramic electronic component design where base external electrodes are discontinuously provided on the ceramic element body, with a resin layer completely covering the base external electrodes and exposed regions on the end surfaces, and a plated external electrode layer provided outside the resin layer. This configuration enhances moisture resistance and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If base external electrodes are discontinuously provided on the ceramic element body, then mechanical strength is improved by reducing residual stress, but moisture resistance deteriorates due to exposed regions
Solution Approach 1:
A resin layer is introduced as an intermediary substance to fill the exposed regions between discontinuous base external electrodes on the ceramic element body. This resin layer acts as a mediator that simultaneously provides mechanical support to maintain strength benefits while creating a moisture barrier to prevent water ingress, thus resolving the contradiction between mechanical strength improvement and moisture resistance deterioration
Solution Approach 2:
The external electrode structure is designed as a composite system combining discontinuous base external electrodes (metal), resin layer (polymer material), and plated external electrode layers. This composite structure leverages the mechanical strength of metal electrodes, the moisture-blocking properties of resin, and the protective benefits of plated layers to achieve both high mechanical strength and excellent moisture resistance simultaneously
2Reliability
If resin layer completely covers base external electrodes and exposed regions, then moisture resistance is improved, but device complexity increases due to additional manufacturing steps
Solution Approach 1:
The formation of the resin layer is combined with the external electrode formation process, where the resin layer is applied and cured in an integrated sequence with the base external electrode and plated external electrode layer formation. This merging of process steps achieves complete coverage for moisture protection while minimizing manufacturing complexity by avoiding separate, independent processing stages
3Reliability
If plated external electrode layer is provided outside resin layer, then electrical conductivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The resin layer is formed and cured as a preliminary step before applying the plated external electrode layer. This preliminary action creates a stable, pre-defined substrate that guides the subsequent plating process, ensuring uniform metal deposition and reducing precision requirements by eliminating the need for complex masking or alignment procedures during plating
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic element body including first and second internal electrodes, first and second main surfaces, first and second lateral surfaces, and first and second end surfaces, and first and second external electrodes respectively on the first and second end surfaces. The first and second external electrodes each include base external electrodes, a resin layer, and at least one plated external electrode layer. The base external electrodes are discontinuously provided on the ceramic element body. The ceramic element body includes exposed regions. The resin layer covers the base external electrodes and the exposed regions. The resin layers completely cover the base external electrodes and the exposed regions on the first and second end surfaces. The first and second external electrodes include a resin layer non-formation region where the resin layer does not cover the base external electrodes or the exposed regions.