Ceramic Electronic Component Surface Electrode Opening
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Solution Overview
Problem
The existing ceramic electronic components face issues with the peeling of the covering ceramic layer from the surface electrode due to differences in sinterability and bond strength, particularly during surface treatments like blasting, caused by variations in the liquid phase supply from the base ceramic layer.
Innovation Solution
Creating openings or thin portions in the peripheral section of the surface electrode allows for the supply of a liquid phase from the base ceramic layer, enhancing the sinterability and bond strength between the covering ceramic layer and the surface electrode, thereby preventing peeling and reducing the risk of anomalous deposition during plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a covering ceramic layer is formed by firing a ceramic green sheet or applying ceramic paste on a surface electrode and base ceramic layer, then the covering ceramic layer can be obtained, but the sinterability differs between areas due to varying liquid phase supply, resulting in lower bond strength on the surface electrode
Solution Approach 1:
The invention applies local quality by creating a specific structural feature (opening or thin portion) only in the peripheral section of the surface electrode where the covering ceramic layer is formed. This localized modification enables targeted liquid phase supply to the covering ceramic layer in the peripheral section, improving sinterability and bond strength specifically where needed, without altering the entire electrode structure.
Solution Approach 2:
The invention segments the surface electrode structure by creating an opening or thin portion in the peripheral section, effectively dividing the electrode into regions with different thickness characteristics. This segmentation allows differential liquid phase supply to different areas, enabling the covering ceramic layer to receive adequate liquid phase for proper sintering in the peripheral section while maintaining the integrity of the central section.
2Strength
If the covering ceramic layer is formed without openings or thin portions, then the structure remains simple, but the covering ceramic layer peels from the surface electrode during surface treatments like blasting
Solution Approach 1:
The invention utilizes a porous or open structure by introducing openings or thin portions in the peripheral section of the surface electrode. This porous-like structure facilitates the supply of liquid phase from the base ceramic layer to the covering ceramic layer during firing, significantly improving bond strength without requiring complex additional components or multi-step processes.
3Reliability
If the covering ceramic layer has poor sinterability on the surface electrode, then the manufacturing process is simpler, but the covering ceramic layer is prone to peeling during surface treatments
Solution Approach 1:
The invention implements preliminary action by pre-forming openings or thin portions in the peripheral section of the surface electrode before the covering ceramic layer is applied. This preliminary structural modification ensures that during the subsequent firing process, liquid phase can be readily supplied to the covering ceramic layer, pre-establishing the conditions for high bond strength and preventing peeling issues before they occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased bond strength and sinterability of the covering ceramic layer on the surface electrode prevent peeling during surface treatments and reduce the risk of plating solution penetration, ensuring a stable and reliable ceramic electronic component.
Implementation Method 1
a path for supplying a liquid phase from a base ceramic layer to the covering ceramic layer on the surface electrode is formed in the surface electrode
Implementation Method 2
during firing, a ceramic component or glass component contained in a base ceramic layer transforms into a liquid phase, which is supplied to the covering ceramic layer
Implementation Method 3
the sinterability of the covering ceramic layer is increased... the bond strength between the covering ceramic layer and the surface electrode is increased
Data Source
AI summary
A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.