Multilayer Ceramic Electrode Structure to Prevent Peeling

The patent applies composite materials by creating a multi-layer metal structure consisting of a base metal layer, an intermediate metal layer, and a plated layer. This composite structure combines the advantages of different metals: the base layer provides adhesion to the ceramic chip, the intermediate layer provides flexibility and stress relief, and the plated layer provides conductivity and solderability. This resolves the contradiction by maintaining manufacturing simplicity while dramatically improving external electrode adhesion and preventing peeling.

The patent changes the physical and chemical parameters of the metal layers, specifically controlling the thickness, composition, and mechanical properties (Young's modulus) of each layer. The intermediate layer is designed with specific parameter ranges to provide optimal flexibility and stress distribution. By carefully adjusting these parameters, the patent achieves both strong adhesion and flexibility without complicating the manufacturing process.

The patent changes the mechanical parameter (Young's modulus) of the metal layers by introducing an intermediate layer with different elastic properties. This intermediate layer acts as a stress buffer, reducing the stress concentration at the interface between the rigid base metal layer and the ceramic chip. The parameter optimization of the intermediate layer's thickness and composition achieves both strength and adhesion without requiring a single material to satisfy conflicting requirements.

The patent uses composite materials to combine a high-strength base metal layer with a more flexible intermediate layer. This composite structure allows the external electrode to maintain high overall strength while the intermediate layer prevents peeling by accommodating thermal expansion differences and reducing stress concentration. The composite approach resolves the contradiction between strength and adhesion by distributing different functions across multiple layers.

The patent applies preliminary action by forming the base metal layer and intermediate metal layer on the ceramic chip before applying the plated layer. This sequence ensures that the adhesion-critical layers are established first on the chip surface, and subsequent plating processes build upon this foundation. By preparing the metal substrate structure in advance, the patent simplifies the overall manufacturing process despite the multi-layer structure, as each subsequent layer builds on the previous one in a systematic manner.

The intermediate metal layer serves as an intermediary between the base metal layer and the plated layer, as well as between the metal electrode and the ceramic chip. This intermediary layer facilitates adhesion, provides stress relief, and enables the plating process to proceed uniformly. The intermediary approach resolves the complexity issue by creating a systematic, modular structure where each layer has a specific function, making the manufacturing process more controllable and repeatable despite the increased number of layers.