Multilayer Ceramic Component Electrode Resin Layer Design
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Solution Overview
Problem
Multilayer ceramic electronic components face issues with ion migration and cracking due to the use of Ag and Cu metallic powders in thermosetting resin layers, which can lead to short circuits and mechanical failure under stress and thermal cycling.
Innovation Solution
A multilayer ceramic electronic component design featuring external electrodes with a resin layer that includes no metal component, preventing Ag ionization and allowing stress relief, thereby reducing ion migration and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If Ag or Cu metallic powder is used in the thermosetting resin layer, then electrical conductivity is improved, but ion migration occurs causing short circuits
Solution Approach 1:
The patent extracts the harmful metal component from the resin layer by providing a resin layer that includes no metal component between the resin electrode layer and the capacitor body, eliminating the source of ion migration while maintaining electrical conductivity through the resin electrode layer's metal powder
Solution Approach 2:
The patent segments the electrode structure into distinct layers: an underlying electrode layer, a resin electrode layer with metal powder for conductivity, and a metal-free resin layer for isolation. This segmentation separates the conductivity function from the isolation function, preventing ion migration while maintaining electrical performance
2Stress or pressure
If the thermosetting resin layer completely covers the baked electrode layer, then stress relief function is improved, but cracking resistance deteriorates due to stress concentration at interfaces
Solution Approach 1:
The patent applies local quality by making the resin layer's metal content vary across different regions: the resin electrode layer contains metal powder for conductivity where needed, while the resin layer adjacent to the capacitor body contains no metal component, creating different local properties optimized for their specific functions
Solution Approach 2:
The patent introduces a metal-free resin layer as an intermediary between the conductive resin electrode layer and the capacitor body. This intermediary layer acts as a buffer that reduces stress concentration and prevents crack propagation while maintaining the stress relief function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents ion migration and enhances resistance to cracking, ensuring the component's reliability under mechanical and thermal stress conditions.
Implementation Method 1
the resin layer includes no metal component, preventing Ag ionization and allowing stress relief, thereby reducing ion migration and cracking
Implementation Method 2
the multilayer ceramic electronic component is designed to produce destructive cracks, starting from an end of the thermosetting resin layer and extending in the thermosetting resin layer, in the interface between the thermosetting resin layer and a nickel plating layer, or in the interface between the thermosetting resin layer and the capacitor body, thus preventing the cracks from extending to the capacitor body
Data Source
AI summary
A multilayer ceramic electronic component includes a stacked body and external electrodes provided on two end surfaces of the stacked body. Each external electrode includes an underlying electrode layer including a conductive metal, a resin electrode layer including a resin and metal component, a resin layer including a resin and no metal component, and a metal layer. The underlying electrode layers extend from the two end surfaces to cover a portion of two main surfaces and two lateral surfaces. The resin electrode layers cover the underlying electrode layers provided on the two end surfaces. The resin layers are connected to the resin electrode layers and provided on the underlying electrode layers located on a portion of the two main surfaces and two lateral surfaces. The metal layers cover the surfaces of the resin electrode layers and resin layers.