Ceramic Electronic Component Electrodes for Resin Wetting Reliability

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Solution Overview

Problem

The mounting reliability of ceramic electronic components is not adequately addressed, particularly in relation to the wettability of resin materials during the formation of conductive or insulating resin films, leading to potential electrical short circuits or inadequate connections.

Innovation Solution

Incorporating a fluorine compound on the surface of the external electrodes of ceramic electronic components, with a controlled peak ratio, to enhance the wettability of resin materials, thereby optimizing the spread and reliability of conductive or insulating resin films.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional external electrode without fluorine compound is used, then the manufacturing process is simple, but the wettability of resin materials is insufficient leading to poor mounting reliability

Engineering Contradiction:
Improvemounting reliabilityVSAvoidelectrode surface treatment
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The fluorine compound is applied to the external electrode surface in advance before the resin material is applied. This preliminary treatment modifies the surface properties to enhance wettability, ensuring that the resin material spreads properly and forms reliable connections during the mounting process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The fluorine compound acts as an intermediary substance between the external electrode and the resin material. It modifies the surface energy characteristics of the electrode, creating optimal conditions for the resin material to wet and adhere to the surface, thereby improving mounting reliability without directly altering the resin or electrode materials themselves.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If the fluorine compound peak ratio is not controlled, then the application process is simple, but the spread of resin films becomes uncontrolled leading to electrical short circuits or inadequate connections

Engineering Contradiction:
Improveresin film spread controlVSAvoidfluorine compound application
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The peak ratio of the fluorine compound is controlled within a specific range (0.03 to 0.30) to optimize the wettability of the external electrode. By adjusting this parameter, the surface properties are precisely tuned to ensure proper spread of the resin material, preventing both electrical short circuits and inadequate connections while maintaining manufacturing feasibility.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The controlled application of a fluorine compound on the external electrodes improves the wettability, ensuring optimal spread of resin films and enhancing the mounting reliability of ceramic electronic components.

Implementation Method 1

the wettability of resin materials is enhanced, thereby optimizing the spread and reliability of conductive or insulating resin films

Methodology Applied
Scientific EffectWetting: Wetting

Data Source

PatentUS20260024704A1Ceramic electronic component and method of manufacturing the same
Publication Date: 2026.01.22 NGK INSULATORS LTD
  • US20260024704A1 patent drawing
  • US20260024704A1 patent drawing
  • US20260024704A1 patent drawing

AI summary

A main body has a first surface, and a second surface opposite to the first surface, the main body including a ceramic portion. At least one external electrode includes a first portion on the first surface of the main body. A fluorine compound exists on a surface of the first portion of the at least one external electrode.