Multilayer Ceramic Component Electrode Roughness Adhesion
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Solution Overview
Problem
The miniaturization of electronic products has led to thinner dielectric and inner electrode layers in multilayer ceramic components, resulting in reduced adhesion strength between these layers, which can cause delamination and degrade the reliability of these components.
Innovation Solution
The solution involves optimizing the thickness and surface roughness of the inner electrodes and dielectric layers, with specific thickness ranges (0.1 μm to 0.5 μm for inner electrodes and up to 1.5 μm for dielectric layers) and surface roughness ratios (5 nm to 30 nm and 150 nm to td/2), achieved by using a metal powder with a mixture of first and second particles of different diameters, to enhance adhesion and withstand voltage characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the inner electrode layers are thinned to achieve miniaturization, then the size of the multilayer ceramic component is reduced, but the adhesion strength between dielectric layers and inner electrodes deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the surface roughness parameters (Ra and Rz) of the inner electrode to specific ranges. By adjusting Ra to 5-30 nm and Rz to 150 nm-td/2 with Rz/Ra ratio of 8-20, the adhesion strength is improved without increasing electrode thickness, thus resolving the contradiction between miniaturization and adhesion strength.
Solution Approach 2:
The patent applies local quality by creating specific surface roughness characteristics at the interface between the dielectric layer and inner electrode. The controlled roughness profile (Ra and Rz values) provides localized adhesion enhancement at the bonding interface while maintaining thin overall electrode thickness, enabling both miniaturization and strong adhesion.
2Quantity of substance
If the dielectric layers are thinned to increase the number of lamination layers, then the capacitance increases, but the adhesion strength between layers deteriorates
Solution Approach 1:
The patent resolves this contradiction by changing the surface roughness parameters of the inner electrode to specific ranges (Ra: 5-30 nm, Rz: 150 nm-td/2, Rz/Ra: 8-20). This allows the use of thinner dielectric layers (td≤1.5 μm) to increase capacitance while the controlled roughness maintains strong adhesion strength, preventing delamination despite reduced layer thickness.
3Length of stationary object
If fine metal powder is used to form thinner inner electrodes, then the electrode thickness is reduced, but the surface roughness decreases leading to poor adhesion
Solution Approach 1:
The patent applies parameter changes by controlling not just the average surface roughness (Ra) but also the peak-to-valley roughness (Rz) and their ratio. By setting Ra to 5-30 nm, Rz to 150 nm-td/2, and Rz/Ra to 8-20, the invention maintains adequate surface roughness for adhesion even when using fine metal powder to achieve thin electrode thickness (0.1 μm≦te≦0.5 μm).
Solution Approach 2:
The patent uses composite materials by combining fine metal particles (average diameter 0.5-2.0 μm) with controlled surface morphology. The metal powder composition and sintering process create a composite structure that maintains both thin thickness and sufficient surface roughness, resolving the contradiction between electrode thinness and adhesion quality.
Data Source
AI summary
There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and inner electrodes disposed to face each other within the ceramic main body, with the dielectric layer interposed therebetween, wherein, when an average thickness of the dielectric layer is td and an average thickness of the inner electrodes is te, 0.1 μm≦te≦0.5 μm and (td+te)/te≦2.5 are satisfied, and when an average surface roughness on a virtual surface roughness center line of the inner electrode is Ra and an average roughness of ten points of the inner electrode is Rz, 5 nm≦Ra≦30 nm, 150 nm≦Rz≦td/2, and 8≦Rz/Ra≦20 are satisfied. The multilayer ceramic electronic component has excellent reliability by improving adhesion strength between the dielectric layer and the inner electrodes and withstand voltage characteristics.