Ceramic Electronic Component Electrode Segmentation for Size Reduction

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Solution Overview

Problem

Multilayer ceramic capacitors have a large outer electrode thickness due to the underlying electrode layer covering the entire outer electrode region, resulting in increased size.

Innovation Solution

The ceramic electronic component design includes an underlying electrode layer only on specific portions of the ceramic body where the outer electrode is located, with a metal-containing layer and plating layers on other surfaces, allowing for a reduced outer electrode thickness and size reduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the underlying electrode layer is provided over the entire region where the outer electrode is provided, then the outer electrode has sufficient coverage and electrical conductivity, but the thickness of the outer electrode increases and the overall size of the ceramic electronic component increases

Engineering Contradiction:

Improveelectrical conductivityVSAvoidcomponent size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The electrode structure is segmented into multiple functional layers: an underlying electrode layer provided only on end surfaces, metal-containing layers on side surfaces, and plating layers connecting them. This segmentation allows each layer to be optimized for its specific function while reducing overall electrode thickness and component size.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the electrode structure are assigned different materials and thicknesses according to their specific functional requirements. The underlying electrode layer on end surfaces provides electrical connectivity, while metal-containing layers on side surfaces provide mechanical strength and stress resistance, and plating layers provide solderability. This local optimization reduces unnecessary material thickness throughout the structure.

Inventive Principle:

Principle #3Local quality

2Volume of moving object

If the outer electrode thickness is reduced by limiting the underlying electrode layer to specific portions, then the component size is reduced, but tensile stress increases which can cause cracks during reflow or bending

Engineering Contradiction:

Improvecomponent sizeVSAvoidstress resistance

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The electrode structure uses composite materials with different properties in different layers. The metal-containing layers (such as Ni or Ni-Cr) provide high mechanical strength and stress resistance, while the plating layers (such as Sn) provide solderability. This composite structure maintains stress resistance even when the overall electrode thickness is reduced.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The electrode structure extends into multiple dimensions with different layers serving different spatial functions. The underlying electrode layer is confined to end surfaces, while metal-containing layers extend on side surfaces, creating a three-dimensional electrode architecture that distributes stress across multiple dimensions rather than concentrating it in a single thick layer.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If the underlying electrode layer is provided only on specific portions, then the outer electrode thickness is reduced, but the manufacturing complexity increases due to multiple layer formation steps

Engineering Contradiction:

Improvecomponent sizeVSAvoidmanufacturing process

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The underlying electrode layer is formed on end surfaces first as a preliminary step, followed by the formation of metal-containing layers on side surfaces, and finally plating layers are applied to connect them. This sequential preliminary action allows each layer to be formed under optimized conditions for its specific material and location, simplifying the overall manufacturing process despite multiple steps.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS11158459B2Ceramic electronic component and method for manufacturing ceramic electronic component

Publication Date: 2021.10.26 MURATA MFG CO LTD

AI summary

A ceramic electronic component includes a ceramic body having first and second end surfaces facing each other, first and second side surfaces facing each other, first and second principal surfaces facing each other, and also includes outer electrodes each of which is provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body. Each of the outer electrodes includes an underlying electrode layer provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body and also includes a plating layer provided on a corresponding one of the underlying electrode layers and on a corresponding one of regions different from the underlying electrode layers.