Multilayer Ceramic Component External Electrode Sheet Transfer
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Solution Overview
Problem
The miniaturization of multilayer ceramic electronic components is hindered by the permeation of plating solutions through thin portions of external electrodes, leading to reliability issues and capacitance variations due to non-uniform electrode thicknesses, which are difficult to achieve with existing dipping methods.
Innovation Solution
A method involving the use of elastic punching and pressing materials to form external electrodes on ceramic bodies with a sheet transfer process, ensuring uniform thickness and increased capacitance by forming external electrodes on end surfaces and corner portions, with controlled thickness ratios to prevent plating solution permeation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of external electrodes is decreased to enable miniaturization, then the size of the multilayer ceramic electronic component is reduced, but the plating solution permeates through the thin portions of the external electrodes, reducing reliability
Solution Approach 1:
The patent applies different paste application methods to different regions of the external electrode. The dipping method is used for head surfaces and band surfaces where uniform thickness is achieved through fluid dynamics, while the printing method is used for end surfaces where precise thickness control is needed to prevent plating solution permeation. This local differentiation of application quality resolves the contradiction between thin electrode thickness and reliability.
Solution Approach 2:
The patent controls the thickness parameter of the external electrode paste through multiple mechanisms: adjusting paste viscosity, controlling dipping speed and angle, optimizing printing parameters (screen mesh count, opening size, squeegee pressure), and setting drying conditions. By precisely controlling these parameters, the electrode thickness is optimized to be thin enough for miniaturization but thick enough to prevent plating solution permeation.
2Ease of manufacture
If the paste application method uses existing dipping technique, then the process is simple, but the paste thickness is non-uniform due to dispersion and fluidity variations, causing plating defects
Solution Approach 1:
The patent segments the external electrode formation process into three distinct operations: dipping for head surfaces, dipping for band surfaces, and printing for end surfaces. Each segment uses the most appropriate method for that specific region, achieving both manufacturing efficiency and thickness uniformity. This segmentation resolves the contradiction by allowing different precision levels in different areas.
Solution Approach 2:
The patent introduces a drying process as an intermediary step between paste application and plating. This intermediary drying step allows the paste to achieve optimal thickness and adhesion before the plating solution is applied, preventing defects. The drying conditions (temperature, time, atmosphere) are controlled as intermediate parameters to ensure consistent results.
3Reliability
If the paste is applied thickly to prevent plating solution permeation, then reliability is improved, but glass beading or blisters are generated and the capacitance is reduced
Solution Approach 1:
The patent applies paste with controlled excess to specific critical areas (end surfaces) where plating solution permeation risk is highest, while using minimal paste thickness in other areas (head and band surfaces) where permeation risk is lower. This partial excessive action prevents the need for uniformly thick paste application, avoiding glass beading and blisters while maintaining reliability in critical regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a high capacitance multilayer ceramic component with reliable and uniform external electrodes, increasing the overlap area of internal electrodes and enhancing capacitance while maintaining structural integrity.
Implementation Method 1
forming an external electrode by cutting the sheet for forming an external electrode using the elastic punching material
Implementation Method 2
pressing and closely adhering the ceramic body to the sheet for forming an external electrode, to attach the sheet for forming an external electrode to the ceramic body
Data Source
AI summary
A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes with a thin and uniform thickness.