Multilayer Ceramic Component Electrode Interface Composition
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Solution Overview
Problem
Multilayer ceramic electronic components face reduced mechanical strength due to plating liquid infiltration, which occurs when the plating liquid penetrates the external electrode and ceramic body, compromising the structural integrity.
Innovation Solution
A multilayer ceramic electronic component design featuring an external electrode with an inorganic matter composition at the interface that includes 26-45 mol% SiO2 and a molar ratio of (TiO2+ZrO2)/(SiO2+TiO2+ZrO2) of 0.154 or more, along with a B2O3/SiO2 ratio of 0.25-0.5, which prevents crystallization and enhances acid resistance, thereby preventing mechanical strength reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional conductive paste with low SiO2 content is used, then the external electrode can be formed with good adhesion, but the glass frit is easily dissolved in plating liquid causing plating liquid infiltration and reduced mechanical strength
Solution Approach 1:
The patent changes the chemical composition parameters of the glass frit, specifically increasing SiO2 content to 30-70 wt% and adjusting B2O3 to 10-40 wt%, to reduce solubility in plating liquid while maintaining adhesion properties
Solution Approach 2:
The patent creates a composite glass frit system combining multiple oxides (SiO2, B2O3, Al2O3, TiO2, ZnO, PbO, Bi2O3) in specific proportions to achieve both good adhesion to the external electrode and resistance to plating liquid dissolution
2Reliability
If glass frit with high BaO and SrO content is used, then the glass frit is less reactive to the ceramic body and less easily permeating, but the external electrode still suffers from plating liquid infiltration due to low SiO2 content
Solution Approach 1:
The patent fundamentally changes the glass frit composition by significantly increasing SiO2 content to 30-70 wt% and B2O3 to 10-40 wt%, which reduces solubility in plating liquid while maintaining or improving adhesion to the external electrode and ceramic body
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the infiltration of the plating liquid and enhances the mechanical strength and reliability of the multilayer ceramic electronic component by maintaining the structural integrity and resistance against plating liquid infiltration.
Implementation Method 1
an inorganic matter is present at an interface of an edge region of an extending-around portion of the external electrode and a ceramic configuring a surface of the ceramic body, the inorganic matter containing 26 mol % or more and less than 45 mol % of SiO2 and having a molar ratio (TiO2+ZrO2)/(SiO2+TiO2+ZrO2) of 0.154 or more, thereby preventing crystallization
Implementation Method 2
the inorganic matter containing 26 mol % or more and less than 45 mol % of SiO2 and having a molar ratio (TiO2+ZrO2)/(SiO2+TiO2+ZrO2) of 0.154 or more, thereby preventing crystallization and enhancing acid resistance
Data Source
AI summary
A multilayer ceramic electronic component in which an interface of an edge region of an external electrode that extends around to a side surface of a ceramic body and the ceramic configuring a surface of the ceramic body, an inorganic matter is present containing 26 mol % or more and less than 45 mol % of SiO2 and having a molar ratio (TiO2+ZrO2)/(SiO2+TiO2+ZrO2) of 0.154 or more, or an inorganic matter is present containing 45 mol % or more of SiO2 and having a molar ratio (TiO2+ZrO2)/(SiO2+TiO2+ZrO2) of 0.022 or more. Furthermore, the inorganic matter may contain B2O3 having a molar ratio relative to SiO2 within 0.25≤B2O3/SiO2≤0.5.