Ceramic Electronic Component Outer Electrode Moisture Resistance
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Solution Overview
Problem
Ceramic electronic components face challenges in moisture resistance while maintaining impact resistance and thermal cycle resistance, as existing solutions with thermosetting conductive pastes compromise on moisture resistance.
Innovation Solution
A ceramic electronic component is produced with an outer electrode layer containing a resin, a first metal filler with a low melting point (e.g., Sn), and a second metal filler with a higher melting point (e.g., Ag), where the electrode layer is heated to form a metal layer on the ceramic body surface, including protruding portions that enhance moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an outer electrode containing a resin is formed using a thermosetting conductive paste, then impact resistance and thermal cycle resistance are improved, but moisture resistance deteriorates
Solution Approach 1:
The outer electrode is formed as a composite material containing both a resin component (for impact and thermal cycle resistance) and a metal powder component with melting point of 300°C or lower (for moisture resistance). This composite structure allows the electrode to simultaneously achieve mechanical flexibility and moisture barrier properties, resolving the contradiction between durability and moisture resistance.
Solution Approach 2:
The invention changes the material parameters of the conductive paste by selecting metal powders with specific melting points (300°C or lower) and controlling the resin content and type. By adjusting these parameters, the outer electrode achieves both the mechanical resilience needed for impact/thermal resistance and the moisture blocking capability, transforming the material properties to satisfy both requirements simultaneously.
2Object-affected harmful factors
If a conventional firing conductive paste is used for the outer electrode, then moisture resistance is improved, but impact resistance and thermal cycle resistance deteriorate
Solution Approach 1:
The outer electrode uses a composite conductive paste containing resin and low-melting-point metal powder, creating a material that combines the moisture-blocking properties traditionally associated with firing pastes with the mechanical flexibility and resilience of thermosetting materials. This composite approach allows simultaneous achievement of moisture resistance and impact/thermal cycle resistance.
Solution Approach 2:
The invention modifies the chemical and physical parameters of the conductive paste by incorporating resin binders and selecting metal powders with melting points of 300°C or lower. These parameter changes enable the outer electrode to exhibit both moisture barrier characteristics and enhanced mechanical resilience, resolving the contradiction between moisture protection and durability under mechanical and thermal stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high moisture resistance, impact resistance, and thermal cycle resistance by forming a metal layer with a Sn—Ag alloy that covers the inner electrodes and connects adjacent portions, improving the ceramic body's rigidity and moisture resistance.
Implementation Method 1
a heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal included in the inner electrode
Implementation Method 2
the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component
Data Source
AI summary
A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.