Ceramic Electronic Component Electrode Buffering Design

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Monolithic ceramic electronic components face challenges in resisting shock and heat-induced stress, leading to cracking and potential short-circuiting, despite the use of resin-containing electrode layers, as existing solutions do not adequately absorb stress and can result in cracks extending into the capacitor body.

Innovation Solution

A ceramic electronic component design featuring a ceramic body with specific dimensions and configurations of inner and outer electrodes, including baked and resin-containing electrode layers, where the distance ratios between electrode edges and effective regions are optimized to prevent cracking and short-circuiting, with A<B<C and A/B ≤ 0.86, ensuring effective buffering and minimizing stress absorption by the resin layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a resin-containing electrode layer is provided to buffer external stress, then the ceramic body does not easily crack, but there is a risk that cracks will extend into the capacitor body from the edge of the base electrode layer before the stress is buffered

Engineering Contradiction:
Improvecrack resistance of ceramic bodyVSAvoidrisk of short-circuiting due to crack extension
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The outer electrode is divided into two distinct layers: a base electrode layer (baked electrode layer) and a resin-containing electrode layer. This segmentation allows each layer to perform its specific function - the base layer provides structural foundation while the resin layer provides stress buffering, thereby preventing crack extension into the capacitor body while maintaining crack resistance of the ceramic body

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The resin-containing electrode layer acts as an intermediary between the mounting board and the ceramic body. It absorbs and buffers external stress before it reaches the ceramic body, preventing direct stress transmission that would cause cracking. The layer is positioned to intercept cracks before they can extend into the capacitor body, serving as a protective mediator

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the resin-containing electrode layer is made thicker to better absorb stress, then shock resistance improves, but the distance relationships between electrode edges and effective regions are compromised

Engineering Contradiction:
Improveshock resistanceVSAvoiddistance ratio control between electrode edges and effective region
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The invention specifies precise parameter ranges for the distance relationships: A/B ≤ 0.86 and A/C ≤ 0.57, where A is the distance from the end surface to the edge of the baked electrode layer, B is the distance to the effective region, and C is the distance to the edge of the resin-containing electrode layer. These parameter constraints ensure that the resin layer has sufficient thickness for stress absorption while maintaining proper geometric relationships for manufacturing precision

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The resin-containing electrode layer is strategically positioned and dimensioned to have different properties in different regions. The layer thickness and position are optimized locally to provide maximum stress buffering capability at the critical edge regions where cracks are most likely to initiate, while maintaining overall dimensional constraints

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The optimized design effectively prevents cracking and short-circuiting by ensuring the resin-containing electrode layers function as buffer layers, reducing the risk of stress-induced damage and maintaining the integrity of the ceramic component.

Implementation Method 1

the resin-containing electrode layer buffers external stress applied to a ceramic body

Methodology Applied
Scientific EffectStress buffering: Viscoelasticity

Implementation Method 2

The baked electrode layer is provided on the ceramic body

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS9406443B2Ceramic electronic component
Publication Date: 2016.08.02 MURATA MFG CO LTD
  • US9406443B2 patent drawing
  • US9406443B2 patent drawing
  • US9406443B2 patent drawing

AI summary

In a ceramic electronic component, when a distance between a first end surface and an edge of a portion of a first baked electrode layer disposed on a second principal surface in a length direction is A, a distance between the first end surface and an effective region in the length direction is B, and a distance between the first end surface and an edge of a portion of a first resin-containing electrode layer disposed on the second principal surface in the length direction is C, A&lt;B&lt;C is satisfied and A/B is about 0.86 or less.