Ceramic Component Surface Electrode Stress Distribution
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Solution Overview
Problem
Ceramic electronic components face issues with bond strength between the surface electrode and the electronic component body, leading to reduced connection reliability when stress is applied, resulting in cracks in the connection electrode and/or the electronic component body.
Innovation Solution
A ceramic electronic component with a surface electrode comprising a three-layer structure, including a first sintered layer, a second sintered layer, and a plating layer, where the first sintered layer has an exposed surface and contains a higher metal oxide content, shifting stress concentration from the end portion to the interior, enhancing bond strength through metal oxide bonding and preventing cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the surface electrode has a two-layer structure with the same size layers, then the manufacturing process is simple, but stress concentration occurs at the end portion leading to cracks
Solution Approach 1:
The surface electrode is segmented into multiple layers (first sintered layer, second sintered layer, and plating layer) with different sizes. The first sintered layer has a larger area than the second sintered layer, creating a stepped configuration that distributes stress across different regions rather than concentrating it at a single point.
Solution Approach 2:
The patent introduces asymmetry in the layer dimensions where the first sintered layer extends beyond the second sintered layer in at least one direction. This asymmetric design creates an exposed surface of the first sintered layer that acts as a stress distribution zone, preventing stress concentration at the end portion of the electrode.
2Strength
If the first sintered layer size is increased relative to the plating layer and second sintered layer, then stress distribution is improved and bond strength is increased, but the device complexity increases
Solution Approach 1:
The patent creates a dynamic stress distribution pathway through the multi-layer structure. When external stress is applied, the force is naturally distributed from the smaller plating layer through the second sintered layer to the larger first sintered layer, which has greater bonding area with the base ceramic layer. This progressive stress distribution enhances bond strength without requiring complex additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the bond strength between the surface electrode and the electronic component body, effectively withstanding external stress and preventing cracks, as demonstrated by improved peeling and drop test results.
Implementation Method 1
the first sintered layer... contains a higher metal oxide content, shifting stress concentration from the end portion to the interior, enhancing bond strength through metal oxide bonding
Implementation Method 2
Adjusting the size of the first sintered layer above the size of the plating layer and the size of the second sintered layer allows the exposed surface to be formed in the upper surface of the peripheral section of the first sintered layer... the origin of stress from outside can be shifted from an end portion of the surface electrode that has low bond strength to the inside of the surface electrode that has high bond strength
Data Source
AI summary
A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer and a surface electrode on a surface of the electronic component body. The surface electrode includes a first sintered layer on the base ceramic layer, a second sintered layer on the first sintered layer, and a plating layer on the second sintered layer. A peripheral section of the first sintered layer has an exposed surface which is not overlaid with the second sintered layer or the plating layer.