Multilayer Ceramic Component External Electrode Thickness Control

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Solution Overview

Problem

Multilayer ceramic electronic components face challenges in forming external electrodes with uniform thickness and adequate corner coverage, leading to potential disconnection and reduced moisture resistance due to the dipping method's limitations in viscosity and surface energy.

Innovation Solution

A method involving transferring a conductive sheet to both surfaces of a ceramic body with dielectric layers and internal electrodes, followed by dipping into a conductive paste to form external electrodes with controlled band portions, ensuring uniform thickness and improved corner coverage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the dipping method is used to form external electrodes, then the manufacturing process is simple, but the external electrode thickness is non-uniform and corner coverage is poor

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidexternal electrode thickness uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The external electrode formation process is segmented into two distinct stages: first forming a conductive layer with uniform thickness using screen printing, then forming a band portion with increased thickness through dipping. This segmentation allows each stage to optimize for its specific function, resolving the contradiction between manufacturing simplicity and thickness uniformity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductive layer is formed in advance using screen printing before the dipping process. This preliminary action ensures uniform thickness and good corner coverage are established first, and then the band portion is added subsequently to provide additional protection and conductivity where needed.

Inventive Principle:

Principle #10Preliminary action

2Ease of manufacture

If the dipping method is used to form external electrodes, then the manufacturing process is straightforward, but moisture resistance reliability deteriorates due to low thickness at outermost electrodes

Engineering Contradiction:

Improveprocess straightforwardnessVSAvoidmoisture resistance reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The external electrode structure implements local quality by having different thickness characteristics in different regions: the conductive layer provides uniform baseline coverage including corners, while the band portion provides localized increased thickness at the outermost edges. This local differentiation ensures both manufacturing feasibility and superior moisture resistance at critical locations.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If external electrode paste with certain viscosity and surface energy is used, then the dipping process is manageable, but uniform thickness cannot be achieved and inflected portions form in bend areas

Engineering Contradiction:

Improvedipping process manageabilityVSAvoidelectrode thickness uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

Instead of attempting to achieve uniform thickness through the dipping process alone, the invention inverts the approach by first creating uniform thickness through screen printing, then using dipping to add material only where needed. This inversion transforms the dipping process from a primary formation method to a supplementary enhancement method, eliminating the thickness uniformity problem.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves uniform external electrode thickness, prevents disconnection, and enhances moisture resistance reliability by maintaining a high thickness ratio of band portions to conductive layers, addressing the limitations of traditional dipping methods.

Implementation Method 1

transferring a conductive sheet to both surfaces of a ceramic body

Methodology Applied

Scientific EffectTransfer printing:

Implementation Method 2

dipping both surfaces of the ceramic body in the first direction into a conductive paste to form first and second external electrodes

Methodology Applied

Scientific EffectDipping deposition: Deposition (physical)

Implementation Method 3

sintering the dipped ceramic body

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS11476051B2Multilayer ceramic electronic component and manufacturing method thereof

Publication Date: 2022.10.18 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion including dielectric layers and first and second internal electrodes laminated with respective dielectric layers interposed therebetween, a first external electrode connected to the first internal electrode and including a first conductive layer and a first band portion, and a second external electrode connected to the second internal electrode and including a second conductive layer and a second band portion. Tb/Tc is 0.85 or more, where Tc is a maximum thickness of each of the first and second conductive layers and Tb is a maximum thickness of each of the first and second band portions.