Ceramic External Electrode Base Layer for Thin Nickel Plating
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Solution Overview
Problem
Existing electronic components with external electrodes formed using conductive paste face limitations in miniaturization due to insufficient chemical stability of the base layer, leading to issues with nickel plating layer formation and adhesion.
Innovation Solution
A ceramic electronic component with a base layer comprising a granulate of a metal material dispersed within a continuous phase of titanium-containing oxide, which enhances chemical stability and allows for a thinner, more uniform external electrode structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a base layer is formed using conductive paste and plated to create an external electrode, then the external electrode can be formed with sufficient thickness and adhesion, but the component size cannot be further miniaturized due to the minimum thickness requirement of the base layer
Solution Approach 1:
The patent changes the chemical composition parameters of the base layer by incorporating specific metal materials (silver, copper, aluminum, or their alloys) with controlled particle sizes (0.1-10 μm) and concentrations (1-50 at%). This compositional parameter optimization enables the base layer to achieve both reduced thickness (0.1-5 μm) and sufficient chemical stability to prevent peeling during nickel plating, resolving the contradiction between miniaturization and reliability.
Solution Approach 2:
The patent creates a composite base layer structure combining metal particles dispersed in a glass matrix. This composite material approach allows the base layer to simultaneously exhibit the electrical conductivity of metal particles and the chemical stability of the glass matrix, enabling thin film formation (0.1-5 μm) while maintaining adhesion strength to prevent peeling during subsequent nickel plating processes.
2Length of moving object
If the base layer is made thinner to enable miniaturization, then the component size is reduced, but the chemical stability and adhesion of the base layer deteriorate, causing peeling during nickel plating
Solution Approach 1:
The patent optimizes critical parameters including metal particle concentration (1-50 at%), particle size (0.1-10 μm), and firing temperature (600-900°C) to achieve a base layer thickness of 0.1-5 μm. These parameter changes ensure that even at reduced thickness, the base layer maintains sufficient adhesion strength (≥100 mN/m) to prevent peeling during nickel plating, while enabling component miniaturization.
Solution Approach 2:
The patent creates local quality variations within the base layer by controlling the non-uniform distribution of metal particles throughout the glass matrix. This local optimization ensures that regions closer to the ceramic body interface provide strong adhesion, while surface regions maintain chemical stability, allowing thin overall thickness (0.1-5 μm) without sacrificing strength or causing peeling.
3Manufacturing precision
If metal particles are dispersed in a glass matrix to form a base layer, then the base layer can be made thinner and more uniform, but the chemical stability deteriorates due to non-uniform dispersion and glass material elution
Solution Approach 1:
The patent precisely controls metal particle size (0.1-10 μm) and concentration (1-50 at%) to achieve uniform dispersion throughout the glass matrix. This parameter optimization ensures homogeneous distribution that prevents localized weak points, enabling thin film formation (0.1-5 μm) with consistent chemical stability across the entire base layer surface, preventing both peeling and glass elution during nickel plating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of a thinner, chemically stable base layer that supports reliable nickel plating, improving the adhesion and durability of the external electrode, thus facilitating the miniaturization of electronic components.
Implementation Method 1
a base layer in which particles of a metal material are dispersed in a glass material containing silicon atoms
Implementation Method 2
a base layer (referred to as a highly dispersed state in Patent Document 1) in which particles of a metal material are dispersed in a glass material containing silicon atoms is formed as a sol-gel fired film on a surface of a ceramic body
Implementation Method 3
when such a ceramic body with a base layer was immersed in a nickel plating solution
Data Source
AI summary
An electronic component that includes: a ceramic body; and an external electrode on a surface of the ceramic body, wherein the external electrode includes: a base layer in contact with the surface of the ceramic body, the base layer including a granulate of a metal material and a continuous phase of a titanium-containing oxide present around the granulate of the metal material; and a plating layer on the base layer.