Ceramic Electronic Component Tip Angle Stress Relaxation
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Solution Overview
Problem
Ceramic electronic components face cracking issues due to stress from external forces, heat expansion, and electrostriction after being mounted on circuit boards, which existing designs struggle to mitigate effectively.
Innovation Solution
The ceramic electronic component features external electrodes with conductive resin layers and specific metal layers, where the tip angles of the wraparound portions are controlled to be 20° or smaller, enhancing stress relaxation and preventing cracking. The production method involves forming these layers with precise dimensions and angles to ensure optimal stress distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional external electrode designs are used, then manufacturing is simpler, but stress relaxation ability is insufficient leading to cracks
Solution Approach 1:
The external electrode is segmented into multiple functional layers: underlying metal layer, intermediate metal layer, conductive resin layer, and external metal layer. Each layer has specific dimensions and tip angles designed to progressively relax stress, preventing cracks while maintaining structural integrity.
Solution Approach 2:
The patent specifies precise parameter ranges for each layer, particularly the tip angles (α ≤ 20° for underlying metal layer, β ≤ 20° for intermediate metal layer) and dimensional relationships (a ≥ b, where a is the difference between wraparound length and end face thickness, and b is the wraparound length of the intermediate metal layer). These parameter optimizations enable effective stress relaxation.
2Reliability
If the conductive resin layer wraparound is made longer to improve stress relaxation, then crack resistance improves, but the electrode structure becomes more complex
Solution Approach 1:
The conductive resin layer is segmented as a distinct intermediate layer between the underlying metal layer and external metal layer. Its wraparound portion extends beyond the intermediate metal layer's wraparound, creating a progressive stress distribution path that relaxes stress effectively while maintaining manageable structural complexity.
Solution Approach 2:
The conductive resin layer is positioned specifically at the wraparound portion where stress concentration occurs. By making its wraparound length greater than the intermediate metal layer's wraparound length, the patent locally enhances stress relaxation capability at the critical stress zone without unnecessarily increasing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces the occurrence of cracks in ceramic components by effectively managing stress through controlled tip angles and layer dimensions, ensuring the ceramic electronic component's reliability and longevity.
Implementation Method 1
the stress can be relaxed by the conductive resin layer 122 of each external electrode 120
Implementation Method 2
the direct stress to the ceramic component body 110 is avoided, so that cracks on the ceramic component body 110 due to the stress can be suppressed
Implementation Method 3
expansion or contraction due to heat of the circuit board
Implementation Method 4
expansion or contraction due to electrostriction of the ceramic component body 110
Data Source
AI summary
A ceramic electronic component includes external electrodes having conductive resin layers thereinside on respective two ends opposed to each other in a rectangular parallelepiped ceramic component body. Each of the external electrodes includes an underlying metal layer, an intermediate metal layer, a conductive resin layer, an external metal layer. A tip angle α between an outer face of a tip portion of the wraparound portion of the underlying metal layer and a surface of the ceramic component body is 20° or smaller, and a tip angle β between an outer face of a tip portion of the wraparound portion of the intermediate metal layer and a surface of the ceramic component body is 20° or smaller.