Ceramic Electronics Module for Hermetic Ventricular Assist Integration
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Solution Overview
Problem
Existing ventricular assist devices, particularly percutaneous devices, face challenges in integrating electronics and sensors due to size constraints, necessitating a solution that allows for compact and hermetic integration of electronic components.
Innovation Solution
The integration of electronics and sensors is achieved by using a suitably shaped pump housing component, manufactured from ceramics with integrated conductor structures, allowing for hermetic closure and electrical contacting within a small installation space, with components like microcontrollers and sensors being integrated into the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronics and sensors are integrated into percutaneous ventricular assist devices, then device functionality is improved, but installation space requirements increase
Solution Approach 1:
The patent combines multiple housing parts (first housing part, second housing part, and pump housing component) into an integrated structure that accommodates electronics, sensors, and motor components. The ceramic pump housing component serves multiple functions: structural support, electrical insulation, and sensor mounting platform, thereby integrating multiple components into a compact arrangement that improves device functionality while minimizing installation space.
Solution Approach 2:
The patent implements a nested arrangement where the electronics are placed inside the pump housing component, which itself is integrated into the motor housing assembly. The sensor is positioned on the pump housing component, creating a hierarchical nesting structure that maximizes space utilization. This nested configuration allows electronics and sensors to be accommodated within the limited volume of the percutaneous device without increasing overall installation space.
2Reliability
If hermetic closure is implemented for motor integration, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs a ceramic pump housing component that combines structural integrity with inherent electrical insulation properties. The ceramic material provides hermetic sealing capability while integrating electrical insulation functions, eliminating the need for separate insulation components. This composite material approach achieves reliable hermetic closure of the motor while simplifying manufacturing by reducing the number of assembly steps and components required.
3Reliability
If ceramics with integrated conductor structures are used, then electrical insulation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes the inherent electrical insulation properties of ceramic materials to provide electrical isolation between conductive elements. By changing the material parameter from metallic to ceramic, the design achieves superior electrical insulation without requiring additional insulation layers or complex insulation structures. The integrated conductor structures are formed within the ceramic housing component, and the material's natural properties ensure reliable electrical insulation while the manufacturing process accommodates standard ceramic fabrication tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the hermetic integration of electronics and sensors within a ventricular assist device, enhancing biocompatibility and reliability while maintaining a compact design, allowing for efficient data processing and communication.
Implementation Method 1
In addition, the thermal insulation properties of ceramics allow decoupling of measurements of an ambient temperature from the motor heat.
Implementation Method 2
Short circuits can also not occur at the contacting sites, e.g., via pins for connecting sensors or hybrid cables.
Data Source
AI summary
The invention relates to an electronics module (102) for a ventricular assist device, wherein the ventricular assist device has a motor housing for accommodating a pump motor. The electronics module (102) comprises an electronics section (204) for accommodating at least one electronic component (206) and/or at least one electrically conductive contacting element (208), and a coupling section (202) designed as a joint between the motor housing (104) and the electronics section (204) or as a separate component to be joined, wherein the motor housing (104) and the electronics section (204) are combined or can be combined via the coupling section (202) with one another to form a fluid-tight module housing (104) to be arranged in a blood vessel.