Ceramic Electrode Feed Structure for Void-Free Brazing
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Solution Overview
Problem
Existing semiconductor manufacturing apparatus members, such as ceramic heaters and electrostatic chucks, face issues with power feeder brazing material layers that either insufficiently contact the power feeder due to design flaws, leading to voids and poor power supply, or have too small a contact area, also causing power supply issues.
Innovation Solution
A member for semiconductor manufacturing apparatus with a power feeder receiving hole and recess design that prevents the second brazing material layer from extending to the boundary between the bottom and side surfaces, ensuring a larger contact area and reducing void formation by using a first brazing material layer with active metal and a second layer without active metal, and chamfering the boundary to prevent material carry-up during production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the second brazing material layer is designed to be in contact with the entire front-end surface of the power feeder, then the contact area is increased, but the second brazing material is likely to be carried up along the side surface of the power feeder during production, causing insufficient brazing material and voids
Solution Approach 1:
The patent applies local quality by creating a recess at the bottom of the power feeder receiving hole where the second brazing material layer is placed. This recess provides a localized area with better wettability and adhesion properties, ensuring reliable bonding between the power feeder and the ceramic plate without requiring the brazing material to extend along the entire side surface. The local modification of the recess structure solves the contradiction by concentrating the brazing function in a specific area rather than distributing it uniformly.
Solution Approach 2:
The recess acts as an intermediary structure that facilitates proper brazing material placement. By providing a designated recessed area, the patent creates an intermediate zone that guides the brazing material to the correct position, preventing it from being carried up along the side surface while still ensuring adequate contact area for reliable power supply.
2Manufacturing precision
If the second brazing material layer is designed to be in contact only with the middle portion of the front-end surface of the power feeder, then the brazing material is prevented from being carried up, but the contact area becomes too small, causing poor power supply
Solution Approach 1:
The recess creates a localized area of enhanced brazing performance. By concentrating the brazing material in the recessed region at the bottom of the receiving hole, the patent achieves both precise material distribution and sufficient contact area. The local quality improvement in the recessed area compensates for the limited contact area, ensuring reliable power supply without requiring extensive brazing material distribution.
3Area of stationary object
If the second brazing material layer extends to the boundary between the bottom surface and side surface of the power feeder receiving hole, then the contact area is maximized, but voids are formed due to insufficient brazing material
Solution Approach 1:
The recess modifies the local geometry at the bottom of the receiving hole, creating a concentrated area for brazing material placement. This local quality enhancement ensures that the brazing material is properly contained and distributed within the recess, preventing void formation while maintaining adequate contact area for reliable electrical connection.
Solution Approach 2:
The recess structure performs a preliminary action by pre-positioning the brazing material in a controlled environment before the actual bonding process. By providing a designated recessed area, the patent prepares the brazing interface in advance, ensuring proper material distribution and preventing voids before the bonding operation completes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures reliable power supply to the electrode by minimizing voids and cracks, enhancing bonding strength, and maintaining insulation distance, thereby improving the operational efficiency and durability of the power feeder.
Implementation Method 1
a first brazing material layer filling the recess
Implementation Method 2
a second brazing material layer bonding an entire end surface of the power feeder to the first brazing material layer
Data Source
AI summary
A member for semiconductor manufacturing apparatus includes a ceramic plate in which an electrode is embedded; a power feeder receiving hole extending from a lower surface of the ceramic plate to a position close to the electrode; a power feeder inserted in the power feeder receiving hole; a recess extending from a bottom surface of the power feeder receiving hole to the electrode or an electrode lead-out portion attached to the electrode, the recess having an opening diameter smaller than a diameter of the power feeder receiving hole and greater than or equal to a diameter of the power feeder; a first brazing material layer filling the recess; and a second brazing material layer bonding an entire end surface of the power feeder to the first brazing material layer and not extending to a boundary between the bottom surface and a side surface of the power feeder receiving hole.