Ceramic Feedthrough Assembly for High-Density Hermetic Conductors
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Solution Overview
Problem
Conventional feedthrough manufacturing techniques face challenges in achieving high conductor density and miniaturization due to limitations in spacing and the use of gold braze rings, which increase costs and lead to potential electrical failures and hermeticity issues in medical applications.
Innovation Solution
The method involves embedding electrical conductors in a ceramic body using a conductor-frame assembly and introducing a fluid ceramic precursor to form a self-supporting body, allowing for precise placement and high-density conductor arrangements without the need for gold braze rings, enabling three-dimensional architectures and reduced conductor spacing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional feedthrough manufacturing techniques are used with gold braze rings, then hermetic bonding is achieved, but conductor spacing is limited and device size increases
Solution Approach 1:
The patent removes the gold braze ring from the feedthrough structure entirely, replacing it with a direct ceramic-to-conductor interface. This extraction of the unnecessary component eliminates the spacing constraint imposed by the braze ring thickness, enabling smaller device dimensions while maintaining hermetic sealing through the ceramic material itself.
Solution Approach 2:
The invention changes the bonding mechanism from mechanical/thermal bonding via gold braze rings to a direct structural integration where conductors are embedded in or directly contact the ceramic body. This parameter change in the bonding approach eliminates the minimum spacing requirement, allowing conductors to be positioned closer together while achieving hermetic seals.
2Quantity of substance
If manual techniques are used to place conductors with gold braze rings, then high pin count is achieved, but manufacturing cost increases and errors increase
Solution Approach 1:
The patent incorporates conductor positioning features directly into the ceramic body during its formation, such as pre-formed holes, recesses, or alignment structures. This preliminary action eliminates the need for manual placement of conductors and their associated gold braze rings, enabling automated manufacturing processes that reduce both cost and error rates while supporting high pin counts.
Solution Approach 2:
The invention replaces the manual mechanical assembly process with automated techniques where conductors are inserted into pre-formed ceramic structures or where the ceramic is formed around conductors in a automated molding or co-firing process. This substitution of manual operations with automated systems reduces manufacturing cost and improves consistency for high-pin-count devices.
3Reliability
If gold braze rings are used to achieve hermetic bond, then bonding is secured, but conductor density is limited
Solution Approach 1:
By removing the gold braze ring entirely and relying on the ceramic material to provide both structural support and hermetic sealing, the patent eliminates the spacing constraint that limited conductor density. The ceramic body itself becomes the sealing medium, allowing conductors to be positioned at minimal spacing while maintaining hermetic integrity.
Solution Approach 2:
The invention creates a composite structure where conductors are directly integrated with the ceramic matrix, forming a unified assembly where the ceramic provides both mechanical support and hermetic sealing. This composite approach eliminates the need for separate braze rings and enables higher conductor density through optimized spatial arrangement.
4Volume of moving object
If feedthrough size is reduced for miniaturization, then device invasiveness is reduced, but conductor spacing becomes insufficient
Solution Approach 1:
The patent fundamentally changes the spacing parameter by eliminating the gold braze ring thickness from the minimum spacing equation. Without this intermediate layer, conductors can be positioned at the theoretical minimum spacing determined only by their diameters and insulation requirements, enabling miniaturization while maintaining adequate spacing for manufacturing precision.
Data Source
AI summary
There is provided a feedthrough including a ceramic body; and a plurality of electrical conductors embedded in the ceramic body. Wherein the density of the electrical conductors exceeds 1 conductor per 23 thou2 (14,839 μm2) through a planar cross-section of the ceramic body.