3D-Printed Ceramic Feedthroughs With Rounded Square Vias
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Solution Overview
Problem
Current ceramic manufacturing techniques are limited in producing complex geometries with high-density vias, leading to difficulties in creating hermetic ceramic assemblies for implantable medical devices, particularly in achieving precise, reliable, and durable electrically conductive pathways with small spacings and high aspect ratios.
Innovation Solution
A 3D-printed ceramic body with square-shaped vias is modeled and processed using additive manufacturing, where the vias are initially printed with rounded corners to reduce stress and then filled with conductive material and co-sintered, enabling the creation of hermetic, high-density feedthroughs with precise geometries and small feature sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional drilling or machining methods are used to create vias in ceramic bodies, then the ceramic material's hardness and strength are maintained, but the ability to create small-diameter vias with high aspect ratios deteriorates due to drill bit breakage and wall defects
Solution Approach 1:
The patent replaces mechanical drilling and machining methods with a 3D printing process that deposits ceramic material layer-by-layer to form vias. This substitution eliminates the mechanical contact that causes drill bit breakage and wall defects, enabling creation of small-diameter vias with high aspect ratios while maintaining via wall integrity through additive rather than subtractive manufacturing
Solution Approach 2:
The patent changes the manufacturing process parameters from mechanical removal (drilling) to additive deposition (3D printing). The 3D printing process uses controlled material deposition with specific layer thicknesses and curing parameters to achieve precise via dimensions and high aspect ratios without the mechanical stresses that compromise via wall integrity in traditional methods
2Productivity
If injection molding or tape casting is used to manufacture ceramic bodies, then production efficiency is improved, but the ability to create complex geometries with high-density vias deteriorates due to geometric constraints
Solution Approach 1:
The patent replaces conventional mechanical forming methods (injection molding, tape casting) with 3D printing technology. This substitution enables the creation of complex geometries with high-density vias that are impossible to achieve with mold-based methods, while maintaining productive throughput through direct digital manufacturing and elimination of expensive custom fixtures
Solution Approach 2:
The patent transitions from 2D planar manufacturing (tape casting) and mold-based 3D forming to true 3D additive manufacturing. This dimensional change enables complex internal geometries, high-density via arrangements, and intricate external features that cannot be achieved with conventional planar or mold-constrained methods
3Quantity of substance
If drill bits are used to create multiple vias in ceramic, then initial via creation is achieved, but subsequent via creation deteriorates as drill bit sharpness decreases and diameter reduces
Solution Approach 1:
The patent replaces the mechanical drilling system with a 3D printing system that creates vias through controlled material deposition. This substitution eliminates tool wear and diameter reduction issues, allowing consistent via diameter and high via count to be achieved without the degradation that occurs when using drill bits for multiple holes
Solution Approach 2:
The 3D printing process is self-service in that it uses digital models to directly guide material deposition without requiring physical tooling that degrades. The digital workflow can be replicated indefinitely without loss of precision, and the printing head deposits material exactly where needed without mechanical contact that would cause wear or diameter changes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the production of robust, reliable ceramic assemblies with precise electrical pathways, overcoming the limitations of traditional techniques by enabling the manufacture of complex geometries and high-density feedthroughs suitable for miniature implantable medical devices, ensuring sustained hermeticity and reliability.
Implementation Method 1
The digitally-modeled design is then 3D-printed to form a green ceramic body comprising the one or more vias
Implementation Method 2
The green ceramic body is then subjected to a sintering process to form a sintered ceramic body
Data Source
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AI summary
A ceramic subassembly manufactured by a 3D-printing process is described. The ceramic subassembly comprises a ceramic substrate having a sidewall extending to spaced apart first and second end surfaces. At least one via extends through the substrate from the ceramic substrate first end surface to the ceramic substrate second end surface. In cross-section, the via has a square-shape with rounded corners.