Ceramic Feedthrough Wire Joint for Reliable Flush Conductor Ends
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Solution Overview
Problem
Conventional feedthrough systems for electronic devices, especially in medical applications, face challenges in attaching connecting wires reliably to the end of electrically conductive pathways, leading to potential failures due to weak connections and microfractures, which can have severe consequences in implantable devices.
Innovation Solution
A feedthrough system with an electrically conductive pathway integrated into the insulating body, featuring an electrically conductive pad and a metal contact element attached via a joint microstructure, allowing for reliable wire attachment through methods like brazing or soldering, thereby reducing the risk of delamination and microfractures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional pin-based feedthrough system is used, then the structure is simple and easy to manufacture, but the connection reliability is poor due to weak connections and potential microfractures
Solution Approach 1:
The patent merges the conductor and insulator into a single integrated ceramic component, eliminating the separate pin and brazing process. The conductive pathway is directly formed within the ceramic insulator body, creating a unified structure that eliminates potential failure points at interfaces while maintaining manufacturing feasibility through co-firing processes.
Solution Approach 2:
The patent employs composite ceramic materials that integrate both insulating and conductive properties within a single body. The ceramic matrix provides electrical insulation while embedded conductive pathways (formed through metal paste infiltration or doped regions) provide electrical conduction, creating a composite structure that simultaneously achieves high reliability and integrated functionality.
2Reliability
If multiple separate components are used in conventional feedthrough systems, then manufacturing is easier, but the number of potential failure modes increases
Solution Approach 1:
The patent combines multiple separate components (insulator, conductor, ferrule) into a single integrated ceramic feedthrough component. This reduction in part count directly reduces the number of interfaces and potential failure modes while the co-firing manufacturing process enables production of this integrated component in a streamlined manner.
Solution Approach 2:
The integrated ceramic feedthrough performs multiple functions simultaneously: electrical insulation, electrical conduction through embedded pathways, mechanical support, and hermetic sealing. This multi-functionality is achieved within a single component structure, reducing the need for multiple specialized parts while maintaining ease of manufacture through unified processing.
3Reliability
If the conductor end is level with the insulator surface, then device miniaturization is enabled, but wire attachment becomes difficult and unreliable
Solution Approach 1:
The patent incorporates preliminary attachment features directly into the ceramic feedthrough structure during manufacturing, such as recesses, protrusions, or integrated contact pads that extend slightly beyond the surface. These pre-formed features facilitate reliable wire attachment before final assembly, ensuring connection reliability while minimizing the overall device volume by integrating the attachment mechanism into the feedthrough body itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the robustness and reliability of the feedthrough system, enabling more efficient preparation and increased robustness, particularly in medical devices, by providing a secure attachment point for wires that minimizes the risk of failure.
Implementation Method 1
The conductive paste may be filled into the holes by a stencil printing step
Implementation Method 2
Many of such filed green tapes may then be assembled in form of a multi-layer body and co-fired at high temperatures
Implementation Method 3
co-fired at high temperatures. The result is a dense, one-piece feedthrough
Implementation Method 4
allowing for reliable wire attachment through methods like brazing or soldering
Implementation Method 5
allowing for reliable wire attachment through methods like brazing or soldering
Data Source
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AI summary
The present invention refers to a feedthrough system (100) comprising a) a feedthrough comprising i) an insulating body (101), ii) an electrically conductive pathway (102), wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) optionally an electrically conductive pad (204), wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element (103) comprising a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough comprises an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present invention refers to a process for preparing the inventive feedthrough system, and to a device comprising the inventive feedthrough system.