Ceramic Flow Passage Member with Graded Grain Boundary for Heat Dissipation
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Solution Overview
Problem
Current flow passage members for semiconductor devices have limitations in heat dissipation, despite providing superior cooling properties, and there is a need for further improvement to maintain high-speed switching under large current conditions.
Innovation Solution
A flow passage member with a ceramic wall structure, where the inner surface has a smaller grain boundary phase area ratio compared to the outer surface, enhancing heat exchange efficiency, and a semiconductor module incorporating this member with a metal layer for effective heat dissipation and mechanical durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional flow passage member with uniform grain boundary phase distribution is used, then the structure is simple and manufacturing is easy, but the heat dissipation properties are insufficient
Solution Approach 1:
The patent applies local quality by creating different grain boundary phase area ratios at different locations within the wall thickness. Specifically, the inner surface (facing the semiconductor device) has a smaller grain boundary phase area ratio to reduce thermal resistance for heat conduction, while the outer surface has a larger grain boundary phase area ratio. This spatial variation in microstructure optimizes heat dissipation throughout the wall thickness rather than using a uniform structure.
2Temperature
If the grain boundary phase area ratio on the inner surface is increased, then heat exchange area is increased, but thermal resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent applies parameter changes by systematically varying the grain boundary phase area ratio as a function of position through the wall thickness. The inner surface region is designed with a lower grain boundary phase area ratio (reducing thermal resistance), while the outer surface region has a higher ratio. This gradient parameter optimization balances heat conduction efficiency with heat exchange capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves excellent heat dissipation properties and enables high-speed switching under high current conditions by efficiently conducting heat from the semiconductor devices to the refrigerant, while maintaining mechanical integrity.
Implementation Method 1
a ratio of an area occupied by a grain boundary phase in an inner surface of a wall part of the wall in which wall part heat exchange is conducted is smaller than a ratio of an area occupied by a grain boundary phase in an outer surface of the wall part
Implementation Method 2
a flow passage member having a flow passage capable of cooling the semiconductor device by heat exchange with a fluid
Data Source
AI summary
A flow passage member includes a wall formed of ceramics, a space surrounded by the wall being a flow passage through which a fluid flows, a ratio of an area occupied by a grain boundary phase in an inner surface of a wall part of the wall in which wall part heat exchange is conducted being smaller than a ratio of an area occupied by a grain boundary phase in an outer surface of the wall part.