Ceramic Frame Lid Metallization for Hermetic Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional methods for producing frame lids for semiconductor packages often result in defects such as metallization errors, outgassing, and poor bonding due to organic content, leading to weakened hermetic seals and potential leak failures.
Innovation Solution
The method involves applying a metal mask to a plate to define a central and peripheral area, metallizing the peripheral area and sidewall to form a continuous seal ring, and then removing the mask, with the option to add sublayers and tack welding a solder preform to the seal ring, using sputter deposition and non-magnetic materials to minimize defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional metallization methods are used on frame lids, then bonding capability is achieved, but metallization errors and outgassing occur leading to weakened hermetic seals
Solution Approach 1:
The patent changes the metallization process parameters by using sputter deposition instead of traditional electroplating or evaporation methods. This results in a more uniform, adherent metallized layer with reduced organic content, eliminating outgassing issues and improving hermetic seal reliability while maintaining bonding capability
Solution Approach 2:
The patent creates a composite structure by metallizing the peripheral area and sidewall of the frame lid to form a continuous seal ring. This composite metallized layer combines the bonding properties of metal with the structural integrity of the frame lid, achieving both sealing and bonding functions while reducing defects
2Strength
If metallized layer is applied to enable soldering, then bonding capability is improved, but mask offset results in non-uniform metallized width weakening the seal
Solution Approach 1:
The patent uses a specifically designed mask as an intermediary tool that precisely defines the peripheral area to be metallized. The mask ensures uniform metallized layer width by accurately positioning the metallization process, preventing mask offset and achieving consistent seal strength around the entire frame lid periphery
Solution Approach 2:
The patent modifies the metallization process parameters including deposition rate, deposition time, and sputtering power to achieve uniform thickness and composition of the metallized seal ring, ensuring consistent bonding strength and hermetic sealing performance
3Strength
If metallized layer is applied to non-metallic frame lid, then bonding capability is achieved, but production cost increases
Solution Approach 1:
The patent applies metallization only to the peripheral area and sidewall of the frame lid where sealing is required, rather than metallizing the entire component. This localized approach achieves the necessary bonding capability for hermetic sealing while significantly reducing material costs and processing time compared to full metallization
Solution Approach 2:
The patent uses partial metallization action by limiting the metallized layer to only the essential seal ring area. This partial action provides sufficient bonding capability for hermetic sealing without the excessive cost of complete frame lid metallization, optimizing both performance and manufacturing economics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces metallization errors, enhances seal strength, minimizes outgassing, and improves bonding, resulting in a more reliable and durable hermetic seal with reduced lead time and increased shelf life.
Implementation Method 1
various methods of making a frame lid. One embodiment can first include applying a metal mask to a central area of a top surface of a plate and define a peripheral area on the top surface, wherein the plate has a top surface, a bottom surface, and a sidewall joining the top surface and bottom surface together. The method can next include forming a seal ring by metallizing the peripheral area and the sidewall of the plate.
Data Source
AI summary
A frame lid for use with a semiconductor package is disclosed. First, a mask is applied to a top surface of the lid and over a central area of the top surface to define a peripheral area. Next, a seal ring is formed by metallizing the peripheral area and the sidewall of the plate. The mask can then be removed obtain the frame lid. Next, a solder preform can be attached to the seal ring. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.