Ceramic Gas Plug Structure for Arc-Safe Wafer Backside Flow
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Solution Overview
Problem
Existing semiconductor manufacturing apparatuses face challenges in manufacturing gas flow paths that are both designed-specific and capable of preventing arc discharge, with porous plugs either lacking stability in gas flow or experiencing insufficient flow rates due to design limitations.
Innovation Solution
A ceramic plug with intersecting linear gas flow paths and opening portions on its surfaces, allowing for precise design and manufacturing of the gas flow path, which inhibits arc discharge while ensuring a sufficient gas flow rate, even with thin paths, by using a method involving a mold created with a 3D printer and ceramic slurry injection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a porous plug with many pores is used as gas flow paths, then the gas flow rate can be increased, but the gas flow paths cannot be manufactured in accordance with design and quality stability deteriorates
Solution Approach 1:
The patent uses a porous plug structure where numerous pores serve as gas flow paths. The pores are formed by dispersing spherical particles and sintering them, creating a controlled porous structure that allows gas to flow through multiple paths simultaneously, thereby increasing the gas flow rate while maintaining manufacturing precision through the standardized particle dispersion and sintering process.
2Quantity of substance
If the gas flow path thickness is increased to ensure sufficient gas flow rate, then the gas flow rate is improved, but arc discharge occurs in the gas flow path and wafer quality deteriorates
Solution Approach 1:
The patent segments the gas flow path into multiple thin pathways by dispersing numerous spherical particles throughout the plug structure. Instead of having a single thick flow path, the gas flows through many thin interconnected pores formed between the particles. This segmentation allows sufficient gas flow rate through the collective effect of multiple paths while keeping each individual path thin enough to prevent arc discharge.
3Object-affected harmful factors
If the gas flow path thickness is decreased to inhibit arc discharge, then arc discharge is prevented, but the gas flow rate becomes insufficient
Solution Approach 1:
The patent transitions from a single-dimension approach (one thick flow path) to a multi-dimensional network of thin flow paths by dispersing particles in three-dimensional space. The spherical particles create a complex 3D porous structure with numerous interconnected pores, effectively adding spatial dimensions to the gas flow paths. This allows the gas to flow through many thin paths simultaneously, preventing arc discharge while maintaining sufficient overall gas flow rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables stable and efficient gas flow paths that can be precisely designed, preventing arc discharge and ensuring a sufficient gas flow rate, thereby improving the quality of semiconductor manufacturing processes.
Implementation Method 1
an electrostatic chuck that has an upper surface that includes a wafer placement portion... a ceramic plate that attracts and holds a wafer
Implementation Method 2
helium that is a heat conduction gas is supplied to a back surface of the wafer via the porous plug in order to improve heat conduction between the wafer and the ceramic plate
Implementation Method 3
high-frequency power is applied between the cooling plate and a flat plate electrode that is disposed at an upper portion of the wafer, and the plasma is generated at the upper portion of the wafer
Data Source
AI summary
A member for semiconductor manufacturing apparatus includes a ceramic plate that has an upper surface that includes a wafer placement portion, and a plug that is installed in a plug installation hole extending through the ceramic plate in an up-down direction and that allows gas to pass therethrough, wherein the plug has a gas flow path that includes a plurality of linear flow paths that is combined such that the plurality of linear flow paths intersects with each other in a plug body, and wherein the gas flow path includes a plurality of opening portions in an upper surface and a lower surface of the plug body.