Ceramic Electronic Component Glass Coating Layer Moisture Resistance
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Solution Overview
Problem
Ceramic electronic components face issues with moisture resistance due to the formation of reaction layers between ceramic bodies and sintered metal films, leading to decreased mechanical strength and reliability, and poor adhesion of plating films when external electrodes are formed using either sintered metal films or plating films alone.
Innovation Solution
A ceramic electronic component with a glass coating layer containing dispersed metal powder particles, where internal electrodes project into the glass coating layer without passing through it, providing electrical conduction paths and enhancing moisture resistance while maintaining a thin external electrode thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an electrically conductive paste is baked to form a sintered metal film for the external electrode, then the external electrode can be formed with good adhesion to the ceramic body, but the baking temperature becomes high causing glass component precipitation (glass floating) and reaction layer formation that decreases mechanical strength and moisture resistance
Solution Approach 1:
The patent introduces a glass coating layer as an intermediary between the ceramic body and the external electrode. This glass coating layer contains dispersed metal powder particles that provide conduction paths, eliminating the need for high-temperature sintering of electrically conductive paste. The glass coating layer bonds to the ceramic body at lower temperatures without causing glass floating or harmful reaction layers, while still providing good adhesion and electrical conductivity for the external electrode.
2Length of stationary object
If the external electrode is made only of a plating film to reduce thickness and avoid reaction layers, then the external electrode thickness decreases and glass floating is eliminated, but plating solution enters the ceramic body through exposed internal electrodes causing decreased moisture resistance
Solution Approach 1:
The glass coating layer serves as a protective intermediary that covers the exposed internal electrodes on the ceramic body surface. This prevents plating solution from penetrating into the ceramic body through the internal electrodes during the plating process. The glass coating layer maintains its integrity and provides a barrier against moisture ingress, ensuring long-term moisture resistance while allowing the external electrode to be formed as a thin plating film.
Solution Approach 2:
The glass coating layer forms a thin film structure that provides protective functionality. This thin film covers the ceramic body surface and exposed internal electrodes, preventing moisture and plating solution penetration while maintaining electrical conductivity through dispersed metal powder particles. The thin film structure allows for reduced external electrode thickness without compromising protection.
3Length of stationary object
If the external electrode is made only of a plating film, then the external electrode thickness is reduced, but the plating film has poor adhesion to the ceramic body allowing moisture entry from between the plating film and ceramic body
Solution Approach 1:
The glass coating layer acts as an intermediary bonding layer between the ceramic body and the plating film. The glass coating layer provides a surface that enhances adhesion for the plating film while maintaining strong bonding to the ceramic body. This intermediary layer ensures robust adhesion strength, preventing moisture penetration from between the plating film and ceramic body, while still allowing for reduced overall external electrode thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves superior moisture resistance and maintains a small external electrode thickness, reducing the likelihood of moisture ingress and improving the mechanical strength of ceramic electronic components.
Implementation Method 1
The glass coating layer covers a portion of the surface of the ceramic body on which the plurality of internal electrodes are exposed
Implementation Method 2
The metal powder particles define conduction paths electrically connecting the plurality of internal electrodes with the electrode terminal
Implementation Method 3
The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film
Data Source
AI summary
A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal.