Ceramic Electronic Component Glass Barrier Plating
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Solution Overview
Problem
Conventional methods for manufacturing ceramic electronic components face challenges such as cumbersome manufacturing processes, increased costs, and yield reduction due to the need for additional steps like forming insulating inorganic layers or protective films, which can lead to erosion of ceramic bodies and short-circuits during plating.
Innovation Solution
A method involving a conductive paste with a glass material that forms a glass layer between the ceramic body and the baked external electrode, extending to the surface, preventing erosion and short-circuits by creating a barrier against plating solutions and ensuring the glass layer's solubility and basicity compatibility with the ceramic body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If strongly acidic plating solutions are used for electrolytic plating, then plated external electrodes can be formed to improve solderability and protect baked external electrodes, but the plating solutions erode the ceramic bodies just below outer edges of the baked external electrodes
Solution Approach 1:
A glass layer is introduced as an intermediary substance between the ceramic body and the baked external electrode. This glass layer acts as a barrier that prevents strongly acidic plating solutions from contacting and eroding the ceramic body, while still allowing the plating process to proceed effectively on the external electrode surface.
Solution Approach 2:
The glass layer is formed on the ceramic body surface before the electrolytic plating process. This preliminary action creates a protective barrier in advance, preventing the harmful effects of acidic plating solutions from reaching the ceramic body during subsequent plating operations.
2Reliability
If conventional methods are used to prevent erosion and short-circuits, then additional steps like forming insulating inorganic layers or protective films are required, but this increases manufacturing complexity and reduces productivity
Solution Approach 1:
The protective function is merged into the conductive paste composition itself. By incorporating glass material into the conductive paste, the paste simultaneously provides electrical conductivity and forms a protective glass layer upon baking, eliminating the need for separate protective layer formation steps.
Solution Approach 2:
The conductive paste is given multiple functions: it provides electrical conductivity for the external electrode and simultaneously forms a protective glass layer on the ceramic body. This multi-functionality reduces the number of manufacturing steps while maintaining reliability.
3Reliability
If plated films are formed on conductive ceramic bodies, then external electrodes can be protected, but plated films may adhere to the surfaces of the ceramic bodies causing short-circuits
Solution Approach 1:
The glass layer serves as an intermediary barrier between the ceramic body surface and the plating solution. This barrier prevents plated films from adhering to the ceramic body surface, eliminating the risk of short-circuits while allowing the external electrode to receive proper plating protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively protects the ceramic body from plating solution erosion and external electrode short-circuits without adding extra manufacturing steps, ensuring the glass layer's solubility and compatibility, thus enhancing the reliability and efficiency of the ceramic electronic component production.
Implementation Method 1
a baked external electrode formed by baking a conductive paste onto a ceramic body
Implementation Method 2
a glass layer derived from a glass material included in a conductive paste
Implementation Method 3
the glass layer extends from the interface between the ceramic body and the baked external electrode to a surface of the ceramic body on which the baked external electrode is not located
Data Source
AI summary
A ceramic electronic component includes a ceramic body, baked external electrodes, and plated external electrodes, and glass layers derived from a glass material included in a conductive paste of the baked external electrodes, are provided at interfaces between the baked external electrodes and the ceramic body, such that the glass layers extend from the interfaces between the ceramic body and the baked external electrodes to a surface of the ceramic body that does not contain the baked external electrodes.