Ceramic Electronic Component Glass Layer Plating Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing ceramic electronic components face mechanical strength reduction and structural defects due to ceramic material dissolution in plating solutions during nickel plating, particularly at side-surface turnover portions of outer electrodes.
Innovation Solution
A glass layer with a Si content of 11% by weight or more and an average thickness of 3 μm to 10 μm is formed within 5 μm of the side-surface turnover portions of outer electrodes to prevent ceramic material dissolution during plating, enhancing mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If outer electrodes are formed with dense metal layers to prevent electrolyte solution ingress, then plating solution resistance is improved, but ceramic material dissolution occurs in Ni plating solution
Solution Approach 1:
The invention applies a glass layer specifically at the side-surface turnover portions of outer electrodes where ceramic dissolution occurs during plating. This localized protection approach addresses the specific problem area without requiring complete redesign of the entire electrode structure, thereby maintaining plating solution resistance while preventing ceramic material dissolution and mechanical strength reduction.
Solution Approach 2:
The glass layer acts as an intermediary protective layer between the ceramic body and the Ni plating solution. It prevents direct contact between the ceramic material and the plating solution, thereby eliminating the dissolution problem while allowing the dense metal layer to maintain its function of preventing electrolyte solution ingress.
2Ease of manufacture
If Ni plating is performed by immersing the ceramic body in Ni plating bath, then plated coatings are formed on outer electrodes, but ceramic material dissolves from side-surface turnover portions
Solution Approach 1:
The glass layer is formed on the side-surface turnover portions of outer electrodes before the Ni plating process. This preliminary protective measure prevents ceramic material dissolution during the plating immersion process, thereby eliminating structural defects such as cracks while maintaining the ease of the immersion plating method.
3Strength
If outer electrodes are made thin to reduce stress on bare chip, then mechanical strength is improved, but ceramic dissolution is more likely to occur
Solution Approach 1:
The glass layer is applied specifically at the side-surface turnover portions where ceramic dissolution occurs, providing localized protection without increasing the overall thickness of the outer electrodes. This maintains the low-stress design while preventing harmful ceramic dissolution.
Solution Approach 2:
The glass layer serves as a protective intermediary that prevents direct interaction between the Ni plating solution and the ceramic body, thereby eliminating dissolution risk while allowing the thin outer electrode design to maintain its mechanical strength advantages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass layer effectively suppresses ceramic material dissolution and ensures good mechanical strength, reducing the incidence of structural defects and maintaining excellent electrical characteristics in ceramic electronic components.
Implementation Method 1
a glass layer which is formed in a region within at least 5 μm in linear distance from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si
Data Source
AI summary
A ceramic electronic component wherein outer electrode is placed over both end portions of a ceramic body. A first coating mainly containing Ni and a second coating containing Sn, solder, or the like are placed on a surface of the outer electrode. The outer electrode includes an end-surface portion and a side-surface turnover portion. The outer electrode includes a glass layer which is placed in a region within at least 5 μm in linear distance L from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si. The average thickness t of the glass layer is 3 μm to 10 μm. The content of a Si component is 11% by weight or more (preferably 40% by weight or less).