Multilayer Ceramic Component Grain Size Gradient for Impact Resistance
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Solution Overview
Problem
Multilayer ceramic electronic components face challenges in maintaining moisture resistance and impact resistance, particularly when used in high-humidity environments or in larger sizes, where increased size leads to weakened corner portions and potential cracking during handling.
Innovation Solution
The design incorporates a multilayer body with varying grain sizes in dielectric layers, where smaller grain sizes on inner layer portions increase grain boundaries to enhance crack resistance and larger grain sizes on outer layers improve adhesion and reduce moisture ingress, while specific grain size distributions and layer configurations enhance impact resistance at corners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the multilayer ceramic electronic component is increased in size to provide larger capacitance, then the capacitance increases, but the impact resistance at the corner portion becomes weak and cracks may be generated
Solution Approach 1:
The patent applies local quality by creating distinct grain size regions within the dielectric layer: a first region with larger average grain size near the outer electrode interface to improve adhesion and suppress moisture entry, and a second region with smaller average grain size in the inner layer portion to enhance crack resistance. This spatial variation in grain size allows different parts of the component to have optimized properties for their specific functions, resolving the contradiction between size/capacitance and impact resistance.
2Quantity of substance
If the ratio of the effective layer defined by the inner electrode is increased to achieve large capacitance, then the capacitance increases, but the thickness of the outer layer becomes thin and moisture is more likely to reach the inner layer portion
Solution Approach 1:
The patent creates a localized region with larger average grain size in the outer layer portion adjacent to the outer electrode interface. This local modification increases adhesion force at the critical interface where moisture would otherwise penetrate, thereby maintaining moisture resistance reliability even when the overall outer layer thickness is reduced to accommodate higher capacitance requirements.
Solution Approach 2:
The dielectric layer is structured as a composite with two distinct grain size regions: an outer region with larger grains optimized for adhesion and moisture barrier properties, and an inner region with smaller grains optimized for mechanical strength and crack resistance. This composite structure allows the component to simultaneously achieve high capacitance through increased effective layer ratio while maintaining moisture resistance through the specialized outer interface region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively secures reliability in moisture resistance and crack resistance, while improving impact resistance, especially in larger components, by obstructing dislocation movement and reducing grain growth, thus preventing crack progression and enhancing structural integrity.
Implementation Method 1
smaller grain sizes on inner layer portions increase grain boundaries to enhance crack resistance
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer body including an inner layer portion in which inner electrode layers face each other, first and second outer layer portions respectively on first and second main surface sides. At the first and second outer layer portions, a grain size in the dielectric layer located on the inner layer portion side and a grain size in the dielectric layer located along each of respective ridgeline portion sides on which respective ones of the first and second main surfaces cross both end surfaces is smaller than the grain size in the dielectric layer located on the respective first and second main surface sides.