Ceramic Grain Structure for Thin MLCC Electrode Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thinning internal and external electrode layers in ceramic electronic devices to achieve miniaturization and increased capacity leads to reduced continuity modulus and potential peeling issues.
Innovation Solution
Implementing a ceramic grain structure with controlled grain size deviations and average sizes at interfaces and peripheries to enhance adhesion and continuity, specifically with standard deviations of 30 nm or less in capacity sections and 15 nm or less in outer peripheries, and larger average grain sizes in dielectric layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If internal and external electrode layers are thinned to achieve miniaturization and increased capacity, then device size is reduced and capacity is increased, but continuity modulus is reduced and peeling occurs
Solution Approach 1:
The patent applies local quality by creating distinct ceramic grain size characteristics in different regions: the capacity section has ceramic grains with standard deviation of 30 nm or less (higher uniformity), while the outer periphery has ceramic grains with standard deviation of 15 nm or less (even higher uniformity). This regional differentiation maintains continuity modulus in thin electrode layers by optimizing grain structure locally where needed most.
Solution Approach 2:
The patent changes physical parameters of ceramic grains (standard deviation of grain size, average grain size) to resolve the contradiction. By controlling ceramic grain standard deviation to be 30 nm or less in capacity sections and 15 nm or less in outer peripheries, the patent maintains structural integrity and continuity modulus even when electrode layers are thinned for miniaturization.
2Volume of moving object
If internal and external electrode layers are thinned to achieve miniaturization and increased capacity, then device size is reduced and capacity is increased, but peeling of external electrodes occurs
Solution Approach 1:
The patent applies local quality by creating distinct ceramic grain size characteristics in different regions: the capacity section has ceramic grains with standard deviation of 30 nm or less (higher uniformity), while the outer periphery has ceramic grains with standard deviation of 15 nm or less (even higher uniformity). This regional differentiation maintains continuity modulus in thin electrode layers by optimizing grain structure locally where needed most.
Solution Approach 2:
The patent changes physical parameters of ceramic grains (standard deviation of grain size, average grain size) to resolve the contradiction. By controlling ceramic grain standard deviation to be 30 nm or less in capacity sections and 15 nm or less in outer peripheries, the patent maintains structural integrity and continuity modulus even when electrode layers are thinned for miniaturization.
Data Source
AI summary
A ceramic grain is provided across an interface between an external electrode and a multilayer chip. In a dielectric layer of a capacity section, a standard deviation of grain size of ceramic grains is 30 nm or less. In an outer periphery surrounding the capacity section of the multilayer chip, a standard deviation of grain size of ceramic grains is 15 nm or less. An average grain size of the ceramic grains in the plurality of dielectric layer of the capacity section is larger than an average grain size of the ceramic grains in the outer periphery.