Ceramic Header Pressure Sensor Leakage Reduction

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Solution Overview

Problem

Conventional pressure sensors with steel housings are costly and susceptible to leakage or damage during assembly, and require complex pass-through structures for electrical signal transmission, which increases the risk of sensor fluid leakage.

Innovation Solution

A differential pressure sensor using a ceramic header body with a metallization ring and fluid displacement structure, which eliminates the need for pass-through apertures and weld rings by integrating the MEMS pressure transducer and circuitry within the ceramic header, reducing leakage risks and assembly complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional steel housing with pass-through structures is used, then electrical signal transmission is achieved, but the device complexity and leakage risk increase

Engineering Contradiction:
Improveleakage resistanceVSAvoidpass-through structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the pass-through structure from the housing design. Instead of having leads pass through the housing wall with complex sealing structures, the electrical connections are integrated directly into the ceramic header body, which is hermetically sealed. This extraction of the problematic pass-through component eliminates the leakage risk while maintaining electrical signal transmission capability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the electrical signal transmission function with the hermetically sealed housing structure. The ceramic header body integrates both the sealing function and the electrical connection function, eliminating the need for separate pass-through structures. The sensor leads are connected directly to the ceramic header interior, merging the sealing and electrical transmission functions into a single integrated component.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If conventional steel housing with pass-through structures is used, then electrical signal transmission is achieved, but manufacturing cost increases

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent eliminates the expensive pass-through sealing structures from the design. By removing this complex component and integrating electrical connections directly into the ceramic header, the manufacturing process is simplified and costs are reduced while maintaining signal transmission reliability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent uses a cost-effective ceramic header body that integrates multiple functions. Rather than using expensive steel housing with complex pass-through sealing mechanisms, the design employs a simpler ceramic header that provides both hermetic sealing and electrical connection capabilities at lower manufacturing cost.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Strength

If conventional steel housing is used, then structural strength is achieved, but susceptibility to damage during assembly increases

Engineering Contradiction:
Improvehousing strengthVSAvoidassembly durability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent uses a ceramic header body that combines the structural strength needed for housing with the chemical inertness and hermetic sealing properties of ceramic materials. This composite approach provides both mechanical strength and protection against assembly damage, while the integrated design eliminates vulnerable pass-through structures that could be damaged during assembly operations.

Inventive Principle:
Principle #40Composite materials

4Adaptability or versatility

If transducer aperture fluid volume is increased, then pressure sensing range is improved, but linearity of response deteriorates

Engineering Contradiction:
Improvepressure sensing rangeVSAvoidresponse linearity
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent optimizes the fluid volume parameter in the transducer aperture to achieve the desired balance between pressure sensing range and response linearity. By carefully controlling and adjusting the fluid volume to an optimal value, the design maintains adequate pressure sensing capability while ensuring linear response characteristics for accurate measurement.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies local quality control by optimizing the fluid volume specifically in the transducer aperture region. Rather than uniformly distributing fluid throughout the entire housing, the design concentrates the fluid volume in the critical transducer aperture area where it is most needed for pressure transmission, while maintaining linearity of response through localized volume optimization.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP3614116B1Pressure sensors and methods of making pressure sensors
Publication Date: 2024.07.24 ROSEMOUNT AEROSPACE INC
  • EP3614116B1 patent drawingFigure 1
  • EP3614116B1 patent drawingFigure 2
  • EP3614116B1 patent drawingFigure 3

AI summary

A pressure sensor (100) includes a MEMS pressure transducer (102) with a pressure sensing diaphragm (113) and sensor elements (108, 110), an isolator diaphragm (136, 152) spaced apart from the pressure sensing diaphragm (113), and a ceramic header body (104). The ceramic header body (104) has an electrical conductor (168, 170) and transducer aperture (134) with the MEMS pressure transducer (102) supported therein. The isolator diaphragm (136, 152) is coupled to the MEMS pressure transducer (102) by a fluid (106, 107) and is sealably fixed to the ceramic header body (104). The ceramic header body (104) bounds the fluid (106, 107) and the electrical conductor (168, 170) electrically connects the MEMS pressure transducer (102) with the external environment.