Ceramic Heat Dissipation Sheet Near Antennas Without Signal Loss
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Solution Overview
Problem
Electronic devices with integrated high-performance components for next-generation communication systems face heat dissipation challenges, leading to performance degradation, and existing heat dissipation materials with high heat dissipation performance often interfere with wireless communication signals due to high dielectric constants.
Innovation Solution
A heat dissipation sheet comprising a ceramic filler, a binder resin, and a high heat dissipation filler with an insulating coating layer is used, positioned adjacent to antenna modules to dissipate heat while maintaining a low dielectric constant, thereby preventing efficiency deterioration of wireless communication signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high heat dissipation materials are used, then heat dissipation performance is improved, but dielectric constant increases adversely affecting wireless signals
Solution Approach 1:
The patent uses a composite material consisting of ceramic particles (alumina, aluminum nitride, or silicon nitride) dispersed in a polymer matrix (polyimide, polyester, or polyethylene terephthalate). This composite structure achieves high heat dissipation performance through the ceramic filler while maintaining low dielectric constant properties through the polymer base material, thereby resolving the contradiction between heat dissipation and wireless signal efficiency.
Solution Approach 2:
The patent optimizes the weight ratio of ceramic particles to polymer at 10:90 to 70:30, and controls the average particle size between 1 μm and 100 μm. By adjusting these parameters, the material achieves optimal balance between thermal conductivity and dielectric constant, enabling effective heat dissipation without degrading wireless communication signal quality.
2Productivity
If integrated components are mounted in smaller space for high performance, then device performance is improved, but heating temperature increases affecting adjacent components
Solution Approach 1:
The heat dissipation sheet is strategically positioned adjacent to high-heat generating components such as antenna modules, power amplifiers, and batteries. This localized heat dissipation approach targets specific hot spots without requiring the entire device structure to be redesigned, enabling effective thermal management in compact high-performance devices.
3Temperature
If heat dissipation sheet is disposed adjacent to antenna module, then heat dissipation is improved, but wireless communication signal efficiency may be deteriorated
Solution Approach 1:
The heat dissipation sheet uses a composite material with ceramic particles (alumina, aluminum nitride, or silicon nitride) in a polymer matrix, which provides high thermal conductivity while maintaining low dielectric constant. This allows the sheet to be disposed adjacent to antenna modules for effective heat dissipation without interfering with wireless communication signals.
Solution Approach 2:
The patent optimizes the ceramic particle content to 30-70 wt% and controls particle size between 1-100 μm. These parameter optimizations ensure the heat dissipation sheet achieves sufficient thermal conductivity for effective heat removal while maintaining low dielectric properties that do not degrade wireless signal quality when placed near antenna modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by electronic components, reducing the risk of performance degradation and maintaining the efficiency of wireless communication signals by using a heat dissipation sheet with a low dielectric constant.
Implementation Method 1
A heat dissipation sheet comprising a ceramic filler, a binder resin, and a high heat dissipation filler with an insulating coating layer is used, positioned adjacent to antenna modules to dissipate heat
Implementation Method 2
maintaining a low dielectric constant, thereby preventing efficiency deterioration of wireless communication signals
Data Source
AI summary
An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.