Multi-Layer Ceramic Heat Sink Structure to Prevent Substrate Bending
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Solution Overview
Problem
Existing heat sinks made of metal materials like copper and aluminum have limitations in heat dissipation and can cause bending or degradation of the substrate due to high thermal expansion, leading to reduced cooling efficiency and semiconductor chip deterioration.
Innovation Solution
A ceramic substrate with a heat sink featuring a multi-layer structure where the intermediate layer has a lower thermal expansion coefficient than the base and flow path layers, allowing refrigerant circulation through a zigzag flow path design to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal heat sink (copper or aluminum) is used for heat dissipation, then thermal conductivity is improved, but thermal expansion causes bending and substrate degradation
Solution Approach 1:
The heat sink uses a composite structure combining metal layers (high thermal conductivity) with ceramic layers (low thermal expansion). The metal layers include copper or aluminum for heat dissipation, while the ceramic layers provide dimensional stability. This composite approach allows the heat sink to maintain both excellent thermal conductivity and resistance to thermal expansion-induced bending.
Solution Approach 2:
The invention changes the material parameters by selecting specific metal-ceramic combinations with complementary properties. The metal layers provide high thermal conductivity (k > 100 W/m·K) while the ceramic layers have low coefficients of thermal expansion. By carefully selecting and combining materials with different thermal properties, the heat sink achieves both high heat dissipation capability and dimensional stability under thermal stress.
2Ease of manufacture
If a single-layer metal heat sink is used, then manufacturing is simple, but heat dissipation efficiency is limited
Solution Approach 1:
The heat sink is divided into multiple functional layers: metal layers for heat conduction, ceramic layers for thermal expansion control, and flow path structures for refrigerant circulation. This segmentation allows each layer to perform its specific function optimally, with metal layers conducting heat efficiently and ceramic layers providing structural stability, thereby achieving superior heat dissipation compared to single-layer designs.
Solution Approach 2:
The invention transitions from a single-layer planar structure to a multi-layer three-dimensional structure with integrated flow paths. The flow paths are formed within the layered structure, allowing refrigerant to circulate through channels that maximize heat exchange surface area. This dimensional complexity enables significantly improved heat dissipation efficiency while maintaining manufacturability through standardized layering processes.
3Temperature
If metal heat sink materials are used, then thermal conductivity is high, but bending occurs due to thermal expansion
Solution Approach 1:
The invention explicitly addresses thermal expansion by incorporating ceramic layers with low coefficients of thermal expansion into the heat sink structure. The ceramic layers act as dimensional stabilizers that counteract the thermal expansion of the metal layers. This design allows the heat sink to maintain high thermal conductivity from the metal components while the ceramic components prevent bending and deformation during thermal cycling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layer structure effectively dissipates heat, prevents bending, and maintains semiconductor chips at a constant temperature by circulating refrigerant, thereby enhancing cooling efficiency and preventing deterioration.
Implementation Method 1
a coefficient of thermal expansion of the at least one intermediate layer may be lower than coefficients of thermal expansion of the base layer and the flow path layer
Implementation Method 2
Refrigerant introduced through the inflow hole may be discharged through the discharge hole via the at least one intermediate layer and the flow path layer
Implementation Method 3
the refrigerant may be continuously circulated by the refrigerant circulation driving unit
Data Source
AI summary
The present invention relates to a ceramic substrate with a heat sink and a manufacturing method thereof. The ceramic substrate comprises: a ceramic substrate including a metal layer on at least one surface of a ceramic base; and a heat sink that is bonded to one surface of the ceramic substrate and has a multi-layer structure that refrigerant enters and exits. The present invention has an integrated structure in which the heat sink having a multi-layer structure that refrigerant enters and exits is bonded to the ceramic substrate, and thus is capable of effectively dissipating heat generated from a semiconductor chip.