Ceramic Heat Sink Substrate With Printed Electrodes Against Warping
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Solution Overview
Problem
Existing heat sinks for power modules, typically made of metal materials like copper or aluminum, have limitations in heat dissipation and can cause warping, leading to degradation of semiconductor chips and performance deterioration due to high-temperature heat generation.
Innovation Solution
A ceramic heat sink integrated with a conductive electrode pattern is formed using a screen-printing method, where a conductive material like Ag, Cu, or their alloys is printed on a ceramic substrate, which is then fired at 350-450°C, enhancing heat dissipation and minimizing process complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal heat sink (copper or aluminum) is used, then thermal conductivity is improved, but heat dissipation capability deteriorates when heat exceeds material limitations causing warping
Solution Approach 1:
The patent uses ceramic materials (such as aluminum nitride, silicon nitride, or aluminum oxide) as the heat sink substrate, which combines high thermal conductivity with high thermal stability and warping resistance. This composite material approach replaces traditional metal heat sinks to simultaneously achieve excellent heat dissipation and dimensional stability under high temperature conditions.
Solution Approach 2:
The patent changes the material parameters by selecting ceramics with specific thermal conductivity and thermal expansion properties. The ceramic heat sink is designed with controlled thermal expansion coefficients and high melting points to maintain structural integrity at temperatures where metal heat sinks would warp or fail.
2Reliability
If a ceramic heat sink is used, then warping resistance is improved, but manufacturing complexity increases due to additional processing steps
Solution Approach 1:
The patent integrates the electrode pattern formation directly into the heat sink manufacturing process. The conductive material is printed on the ceramic heat sink surface and fired together with the heat sink in a single thermal processing step, combining what would traditionally be separate manufacturing operations into one unified process.
Solution Approach 2:
The conductive material pattern is applied to the ceramic heat sink before the final firing step. This preliminary application allows the electrode pattern to be formed simultaneously with the heat sink sintering process, eliminating subsequent separate electrode fabrication and assembly steps.
3Device complexity
If screen printing method is used to form electrode pattern, then manufacturing complexity is reduced, but manufacturing precision may be affected
Solution Approach 1:
The patent optimizes the firing parameters (temperature, time, atmosphere) to ensure that the conductive material forms precise electrode patterns during the heat sink manufacturing process. By carefully controlling the thermal processing parameters, the screen-printed pattern achieves the required precision for electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat dissipation, prevents warping, and maintains stable bonding with excellent wire bondability, while reducing manufacturing complexity and enabling lightweight, small-sized structures.
Implementation Method 1
forming an electrode pattern by firing the conductive material
Implementation Method 2
a heat sink is bonded to at least one surface of a ceramic or metal substrate to prevent the degradation of semiconductor chips caused by heat
Implementation Method 3
the liquid coolant circulating through the coolant circulation unit may perform heat exchange with the plurality of protrusions
Data Source
AI summary
A method of manufacturing a heat sink-integrated power module substrate according to an embodiment of the present disclosure may include preparing a ceramic heat sink, forming a pattern of a conductive material on a top surface of the ceramic heat sink, and forming an electrode pattern by firing the conductive material. Here, the pattern of the conductive material may be formed on the top surface of the ceramic heat sink using screen printing.