Ceramic Heater Structure With Internal Electrodes for Crack Control
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Solution Overview
Problem
Ceramic-based structural bodies used in heating apparatuses face challenges with thermal uniformity and crack prevention due to temperature changes, as well as inefficient heat distribution and release.
Innovation Solution
A structural body comprising a ceramic base with integrated metal electrode layers and via conductors that connect these layers, allowing for improved heat distribution and thermal uniformity, while also suppressing thermal deformation and crack formation through the use of a connection conductor and terminal configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a ceramic base is used for high thermal conductivity, then heat distribution is improved, but thermal uniformity deteriorates due to temperature changes causing cracks
Solution Approach 1:
The patent uses a composite structure combining ceramic base material with metal electrode layers and via conductors. The ceramic provides thermal conductivity while the metal components accommodate thermal expansion differences, preventing cracks during temperature changes while maintaining heat distribution efficiency.
Solution Approach 2:
The patent modifies the ceramic base by incorporating via conductors and electrode layers that change the thermal and mechanical parameters of the structure. These modifications allow the base to handle thermal stress better while maintaining adequate thermal conductivity for heat distribution.
2Reliability
If metal electrode layers are integrated into the ceramic base, then electrical connectivity is improved, but thermal deformation increases due to differential thermal expansion
Solution Approach 1:
The patent accounts for thermal expansion by designing the via conductors and electrode layers to accommodate differential expansion between ceramic and metal materials. The structure allows for controlled movement and expansion without causing deformation or failure during heating cycles.
Solution Approach 2:
The integration of metal electrodes and via conductors into the ceramic base creates a composite structure where each material contributes its advantageous properties. The metal provides electrical connectivity while the ceramic provides thermal stability, with the composite design managing the interface between materials during thermal cycling.
3Reliability
If via conductors are used to connect electrode layers, then electrical connection is improved, but heat distribution efficiency deteriorates due to additional thermal resistance
Solution Approach 1:
The patent extracts the via conductors as separate, optimized components rather than attempting to create monolithic electrical connections. This allows the via conductors to be specifically designed for electrical connectivity while minimizing their thermal resistance impact on the overall heat distribution system.
Solution Approach 2:
The via conductors serve dual functions as both electrical connectors and thermal pathways. By selecting appropriate materials and dimensions for the via conductors, the patent achieves adequate electrical connection while maintaining sufficient thermal conductivity to minimize heat distribution inefficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal uniformity and prevents cracking by efficiently distributing heat and managing thermal expansion, improving the reliability and effectiveness of the heating apparatus.
Implementation Method 1
a base (10), a first electrode layer (111), a second electrode layer (112)
Data Source
AI summary
A structural body (2, 2A to 2E) according to the present disclosure includes a base (10, 10D, 10E), a first electrode layer (111), a second electrode layer (112), a first via conductor (131), a second via conductor (132), and a connection conductor (133). The base (10, 10D, 10E) is composed of a ceramic. The first electrode layer (111) and the second electrode layer (112) are located inside the base (10, 10D, 10E). The first via conductor (131) and the second via conductor (132) are located inside the base (10, 10D, 10E) and connect the first electrode layer (111) and the second electrode layer (112). The connection conductor is located inside the base (10, 10D, 10E), and connects the first via conductor and the second via conductor.