Ceramic Heater Substrate Layout With Fewer Jumper Electrode Layers
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Solution Overview
Problem
The increasing number of heater electrodes in semiconductor manufacturing equipment leads to a rise in manufacturing costs due to the need for multi-layered jumper electrodes, complicating the manufacturing process.
Innovation Solution
A ceramic substrate design with a terminal dense portion and multiple jumper electrode layers, where each jumper electrode is planar and isolated by an insulator, connecting to heater electrodes via vias, reduces the number of jumper electrode layers by optimizing the connection of terminals to planar jumper electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of heater electrodes is increased to improve wafer temperature distribution control, then the temperature control precision is improved, but the number of jumper electrode layers increases leading to higher manufacturing costs and device complexity
Solution Approach 1:
The patent transitions from planar electrode arrangements to a three-dimensional stacked configuration with multiple jumper electrode layers connected via vias through the ceramic substrate. This vertical dimensionality allows multiple heater electrodes to be electrically connected through stacked jumper layers, enabling precise temperature control for multiple heater zones while managing the complexity through systematic layering and via connections
2Measurement precision
If the number of heater electrodes is increased to improve wafer temperature distribution control, then the temperature control precision is improved, but the manufacturing cost increases due to more jumper electrode layers
Solution Approach 1:
The patent segments the jumper electrode connections into multiple separate layers, with each jumper electrode layer containing specific connections to particular heater electrodes. This segmentation allows for modular manufacturing where each layer can be independently formed and connected via vias, making the complex multi-heater configuration more manageable and cost-effective to produce
3Adaptability or versatility
If multiple jumper electrode layers are added to connect increased number of heater electrodes, then the temperature distribution control ability is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent implements a nested structure where jumper electrode layers are stacked vertically with vias penetrating through the ceramic substrate to connect lower layers to upper layers. Each jumper layer is nested within the overall vertical structure, with connections flowing from one layer to the next through the via channels, creating an organized hierarchical connection system that manages manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for improved wafer temperature distribution control with reduced manufacturing costs by minimizing the number of jumper electrode layers, enhancing the efficiency and cost-effectiveness of semiconductor manufacturing equipment.
Implementation Method 1
each of 70% or more of all the terminals arranged in the terminal dense portion is electrically connected to a predetermined planar jumper electrode through a first via extending in the vertical direction
Implementation Method 2
each of the jumper electrode layers is composed of a plurality of planar jumper electrodes that are electrically isolated by an insulator
Implementation Method 3
each of the plurality of planar jumper electrodes is electrically connected to a first connection portion of a predetermined heater electrode selected from the plurality of heater electrodes through a second via extending in the vertical direction
Implementation Method 4
a plurality of heater electrodes which are zoned
Data Source
AI summary
A member for a semiconductor manufacturing equipment includes a ceramic substrate including: a terminal dense portion, a plurality of heater electrodes which are zoned, and a plurality of jumper electrode layers; wherein each of the jumper electrode layers is composed of a plurality of planar jumper electrodes that are electrically isolated by an insulator, and wherein in at least one of the terminal dense portion, each of 70% or more of all the terminals arranged in the terminal dense portion is electrically connected to a predetermined planar jumper electrode through a first via extending in the vertical direction, on a condition that it is not electrically connected to a planar jumper electrode located in a layer above any other planar jumper electrode to which other terminals that have a longer distance from an outer periphery of the terminal dense portion than itself are electrically connected.