Ceramic Heater Showerhead for High-Temperature Substrate Processing

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Solution Overview

Problem

Conventional substrate processing apparatuses face challenges in accurately processing substrates with bowing phenomena, particularly when heating is required for high-temperature processes, as metal heaters are prone to damage and ceramic heaters struggle with gas processing.

Innovation Solution

A showerhead assembly with a ceramic heater body at the upper portion of the substrate, featuring an airtight unit with a shutter and elastic pressurizer to seal the space between the heater and the chamber, allowing for efficient gas supply and heat management during high-temperature processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a metal heater is used on the upper portion of the substrate, then hole processing for gas supply is free, but the heater is damaged due to expansion in high-temperature environments

Engineering Contradiction:
Improvehole processingVSAvoidheater damage
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The heater body is constructed as a composite structure combining ceramic material (for high-temperature resistance) with integrated heating elements and gas supply channels. This composite design allows the heater to withstand high temperatures without damage while maintaining the capability for hole processing and gas supply.

Inventive Principle:
Principle #40Composite materials

2Reliability

If a ceramic heater is used on the upper portion of the substrate, then high-temperature processes are coped with, but hole processing for gas supply is difficult

Engineering Contradiction:
Improvehigh-temperature resistanceVSAvoidhole processing
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The heater body is segmented into multiple functional zones with gas supply holes formed at different locations and angles. This segmentation allows process gas to be supplied to different regions of the substrate simultaneously while maintaining the ceramic material's high-temperature resistance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The ceramic heater body incorporates locally optimized features including gas supply holes positioned at specific locations with controlled dimensions and orientations. This local quality optimization enables effective gas distribution while preserving the overall high-temperature resistance of the ceramic material.

Inventive Principle:
Principle #3Local quality

3Adaptability or versatility

If the substrate edge is supported for lower surface processing, then thin film deposition on lower surface is enabled, but substrate heating from lower portion becomes difficult

Engineering Contradiction:
Improvelower surface processingVSAvoidsubstrate heating
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

Instead of heating the substrate from the lower surface (conventional approach), the invention inverts the heating approach by placing the heater body on the upper surface of the substrate. This inverted configuration enables both lower surface processing through edge support and effective substrate heating from the upper side.

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise and reliable substrate processing even at high temperatures by minimizing heater expansion and maintaining a sealed diffusion space for gas supply, thus addressing the limitations of conventional heating methods.

Implementation Method 1

an elastic pressurizer configured to elastically pressurize the shutter ring

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

a heater body configured to heat a substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240042462A1Showerhead assembly and substrate processing apparatus
Publication Date: 2024.02.08 TES CO LTD
  • US20240042462A1 patent drawing
  • US20240042462A1 patent drawing
  • US20240042462A1 patent drawing

AI summary

The present disclosure relates to a showerhead assembly and a substrate processing apparatus, and more particularly to a showerhead assembly and a substrate processing apparatus including a ceramic heater that heats a substrate and by which hole processing is freely performed in a relatively high temperature process.