Ceramic Heater Terminal Structure for Airtightness and Oxidation Prevention
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Solution Overview
Problem
Existing ceramic heaters used in semiconductor manufacturing devices face challenges in efficiently heating wafers while maintaining airtightness and preventing oxidation of internal conductors, particularly at the terminal portions.
Innovation Solution
A ceramic structure with a protruding portion and terminal portions formed of a ceramic member, bonded via a bonding member, which seals the gap and maintains airtightness, preventing heat transfer and oxidation, and includes a controller for power supply management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the terminal portion is exposed from the lower surface of the base, then electrical connection is achieved, but airtightness and oxidation prevention are compromised
Solution Approach 1:
A ceramic protruding portion is introduced as an intermediary structure between the base and the external environment. The terminal portion passes through this protruding portion, allowing electrical connection while the ceramic material maintains airtightness and prevents oxidation. The bonding member seals the interface between the terminal portion and the protruding portion, further ensuring airtightness.
2Reliability
If the terminal portion is flush with the lower surface of the base, then a simple structure is achieved, but heat transfer and oxidation occur at the terminal portion
Solution Approach 1:
The base structure is segmented by adding a protruding portion that extends from the lower surface. This segmentation isolates the terminal portion within the protruding portion, separating it from the external environment. The bonding member further segments the structure by sealing the interface between the terminal portion and the protruding portion, preventing heat transfer and oxidation.
3Reliability
If the lower surface of the base is planar, then manufacturing is simplified, but heat transfer to the external environment occurs
Solution Approach 1:
The protruding portion is strategically positioned at the location where the terminal portion exits the base, rather than changing the entire lower surface geometry. This localized modification retains the simple planar lower surface for most of the base while providing the necessary structure for heat retention and oxidation prevention at the critical terminal portion area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic structure efficiently heats the wafer surface while improving airtightness and preventing corrosion of the internal conductor, ensuring consistent performance over time.
Implementation Method 1
a ceramic heater provided with a resistive heating body as the internal conductor in the base formed of ceramic
Implementation Method 2
preventing oxidation of internal conductors, particularly at the terminal portions
Data Source
AI summary
A heater includes a base, a resistive heating body, and a terminal portion. The base is formed of ceramic and has a plate shape. The resistive heating body is located in the base. The terminal portion is electrically connected to the resistive heating body. The base includes a protruding portion surrounding the terminal portion, on a lower surface side. The protruding portion is formed of a ceramic member, and the terminal portion passes through a through hole formed in the ceramic member. The ceramic member is bonded to at least one of the lower surface of the base or the terminal portion.