Ceramic Heater Layout for Wafer Thermal Uniformity
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Solution Overview
Problem
Existing ceramic heaters with coil resistance heating elements face challenges in achieving thermal uniformity due to the need for spacing between adjacent coils, which results in insufficient heat distribution around gas holes and lift pin holes, making fine temperature adjustments difficult.
Innovation Solution
Incorporating a sub resistance heating element with a two-dimensional shape on a parallel plane to complement the main coil heating element, allowing for increased wiring density and flexibility, and potentially containing ceramics to match thermal expansion coefficients and enhance bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coil-shaped resistance heating elements are used, then the heating element can be manufactured with high-temperature resistance, but the adjacent coils must be spaced from each other to prevent short-circuiting, resulting in insufficient thermal uniformity
Solution Approach 1:
The heating element is divided into two independent parts: a coil-shaped main resistance heating element for high-temperature heating and a two-dimensional sub resistance heating element for fine temperature adjustment. This segmentation allows each part to fulfill its specific function without interference, resolving the contradiction between high-temperature resistance and thermal uniformity.
Solution Approach 2:
The invention introduces a second plane parallel to the first plane where the main coil heating element is located. The sub resistance heating element with two-dimensional shape is disposed on this second plane, allowing it to fill gaps and provide supplemental heating in areas where the coil spacing creates thermal deficits, thereby achieving thermal uniformity without compromising the high-temperature resistance of the coil structure.
2Temperature
If coil-shaped main resistance heating element is used, then high-temperature heating is achieved, but fine temperature adjustment becomes difficult due to wiring restrictions
Solution Approach 1:
The heating system is segmented into a main heating function (coil element) and a fine-adjustment function (sub element). The sub resistance heating element with two-dimensional shape can be manufactured by printing with flexible wiring patterns, enabling precise local temperature control to complement the bulk heating from the coil element.
Solution Approach 2:
The invention changes the geometric parameters of the heating element from a three-dimensional coil structure to a two-dimensional printed pattern. This parameter change allows for increased wiring density, decreased line width and line distance, and greater design freedom, thereby enabling fine temperature adjustment while maintaining the high-temperature heating capability of the original coil structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables sufficient thermal uniformity and fine temperature adjustments, even with coil-shaped main resistance heating elements, by allowing for closer spacing and more precise temperature control across the wafer placement surface.
Implementation Method 1
a main resistance heating element that is disposed on a first plane parallel with the wafer placement surface in the ceramic plate and that has a coil shape, and a sub resistance heating element that is disposed on a second plane parallel with the first plane in the ceramic plate
Data Source
AI summary
A ceramic heater includes a ceramic plate, a main resistance heating element, and sub resistance heating elements. The main resistance heating element is a heating element that is disposed on a first plane parallel with a wafer placement surface in the ceramic plate and that has a coil shape. The sub resistance heating elements are heating elements that are disposed on a second plane parallel with the first plane in the ceramic plate between the first plane and the wafer placement surface, that complement heating with the main resistance heating element, and that have a two-dimensional shape.