Ceramic Heater With Localized Thickness Control For Wafer Temperature Uniformity
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Solution Overview
Problem
Ceramic heaters used in plasma treatment of wafers face challenges in achieving uniform temperature distribution, with the existing designs being difficult to manufacture and prone to thermal conduction issues, leading to non-uniform heating and potential damage.
Innovation Solution
A ceramic heater with a disk-shaped ceramic plate featuring inner- and outer-peripheral-side heater elements, where the ceramic plate's thickness in a predetermined zone is 3.9% or less of its diameter, allowing for a temperature gradient profile with a flat central zone and gradually increasing or decreasing temperature towards the periphery, achieved by controlling the heater elements to maintain a predetermined temperature difference between the center and periphery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the ceramic plate thickness is reduced in the predetermined zone to achieve the desired temperature gradient profile, then temperature uniformity in the central zone is improved, but the mechanical strength and structural stability of the ceramic plate deteriorate
Solution Approach 1:
The ceramic plate is designed with non-uniform thickness distribution, where the thickness in the predetermined zone (boundary zone between inner and outer peripheral zones) is specifically reduced to 3.9% or less of the ceramic plate diameter. This local thinning creates higher thermal resistance in the boundary zone, preventing excessive heat conduction from the outer peripheral zone to the central zone, thereby maintaining temperature uniformity in the central zone while preserving overall structural integrity through the thicker inner and outer peripheral zones.
2Stress or pressure
If the ceramic plate thickness is reduced to prevent thermal conduction damage, then thermal stress is reduced, but the structural integrity and damage resistance of the ceramic heater deteriorates
Solution Approach 1:
The ceramic plate employs localized thickness reduction only in the predetermined boundary zone, while maintaining adequate thickness in the inner peripheral zone and outer peripheral zone. This selective thinning approach reduces thermal stress concentration at the boundary where temperature gradients are steepest, while the thicker inner and outer zones preserve structural integrity and resistance to mechanical damage.
Solution Approach 2:
The ceramic plate is functionally segmented into three zones: inner peripheral zone, predetermined boundary zone, and outer peripheral zone, each with different thickness characteristics. The inner peripheral zone and outer peripheral zone maintain sufficient thickness for structural support, while the boundary zone is thinned to manage thermal stress and control heat flow, effectively dividing the structural and thermal management functions.
3Ease of manufacture
If the ceramic plate is made thinner to achieve the temperature gradient profile, then manufacturing complexity is reduced, but the heat resistance and thermal management capability deteriorates
Solution Approach 1:
Rather than uniformly thinning the entire ceramic plate, the invention applies thickness reduction only to the predetermined boundary zone, maintaining adequate thickness in other areas for heat resistance. This localized approach achieves the desired temperature gradient profile and reduces manufacturing complexity compared to designing a completely thin plate, while preserving necessary thermal management capabilities through selective thickness control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures a nearly flat temperature distribution in the central zone and a gradual temperature rise or fall towards the periphery, reducing thermal stress and preventing damage, while maintaining sufficient strength and heat resistance.
Implementation Method 1
one or more inner-peripheral-side heater elements embedded in an inner peripheral zone of the ceramic plate, and one or more outer-peripheral-side heater elements embedded in an outer peripheral zone of the ceramic plate
Implementation Method 2
a difficulty in manufacturing is high and a damage risk accompanies due to thermal conduction occurred inside the ceramic heater
Data Source
AI summary
A ceramic heater includes a disk-shaped ceramic plate with an upper surface defining a wafer placement surface on which a wafer is to be placed. One or more inner-peripheral-side heater elements are embedded in an inner peripheral zone of the ceramic plate, and one or more outer-peripheral-side heater elements are embedded in an outer peripheral zone of the ceramic plate. A thickness of the ceramic plate in a predetermined zone is 3.9% or less of a diameter of the ceramic plate. The predetermined zone is a zone including a boundary line between the inner peripheral zone and the outer peripheral zone.


