Ceramic Heater Layout for Uniform Wafer Temperature Control
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Solution Overview
Problem
Existing ceramic heaters face issues in achieving a target temperature distribution due to heat generation from jumper wires and overlapping gaps between resistance heating elements, leading to hot and cool spots on the wafer placement surface.
Innovation Solution
The ceramic heater design features resistance heating elements embedded in different planes of the ceramic plate, with non-overlapping gaps between turn-back sections to reduce hot and cool spots, and uses inner and outer zone weighted heating elements for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If jumper wires are used to connect terminals to the outer-peripheral-side resistance heating element, then electrical connection is achieved, but heat is generated from the jumper wire causing deviation from target temperature distribution
Solution Approach 1:
The jumper wire is extracted and eliminated from the system. Instead of using a separate jumper wire to connect the terminal to the resistance heating element, the resistance heating element itself is extended to directly connect to the terminal, thereby eliminating the source of unwanted heat generation while maintaining electrical connection
2Ease of manufacture
If resistance heating elements are wired in a one-stroke pattern with multiple turn-back sections, then the heating element can be embedded in the ceramic plate, but overlapping gaps between turn-back sections cause hot spots and cool spots
Solution Approach 1:
The patent transitions from a two-dimensional planar wiring pattern to a three-dimensional spatial arrangement by embedding the heating element at different depths (first plane and second plane) within the ceramic plate. This dimensional change allows the gaps between turn-back sections to be positioned at different depths, preventing their projection from overlapping on the wafer placement surface, thereby eliminating hot spots and cool spots
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables accurate temperature distribution with reduced hot and cool spots, allowing for precise temperature adjustment and control in semiconductor manufacturing processes.
Implementation Method 1
an inner-peripheral-side resistance heating element and an outer-peripheral-side resistance heating element are embedded in a ceramic plate
Data Source
AI summary
A ceramic heater includes a disc-shaped ceramic plate having a wafer placement surface, and a shaft provided on a surface on an opposite side of the wafer placement surface of the ceramic plate. First and second resistance heating elements are embedded inside the ceramic plate. When the ceramic plate is viewed from above, the gap (first gap) between first turn-back sections which face each other in a circumferential direction, and the gap (second gap) between second turn-back sections which face each other in a circumferential direction are arranged so as not to overlap.