Ceramic Heating Device Uniform Gas Flow Adjustment
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Solution Overview
Problem
Conventional heating devices used in semiconductor and liquid crystal manufacturing processes face challenges in uniformly distributing gas flow rates through gas injection ports, leading to uneven deposition of reacted films on substrate heating surfaces, which can result in substrate breakage and difficulties in adjusting gas flow passages once fabricated.
Innovation Solution
The heating device incorporates a ceramic base with embedded resistance heating and adjustable gas flow rate mechanisms, featuring gas injection ports and introduction ports, along with insertion portions and holes that allow for precise adjustment of gas flow rates through the gas flow passages, ensuring uniform injection amounts and reduced deposition on the substrate's outer circumference without affecting film growth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If gas injection ports are provided on the substrate heating surface to prevent reacted film deposition on the outer circumferential portion of the substrate, then the deposition of reacted film is reduced, but the injection amounts of gas from the gas injection ports become non-uniform due to variations in gas flow passages
Solution Approach 1:
The patent changes the physical state of the base material from fired ceramics (hard, difficult to modify) to green state ceramics (soft, moldable). This parameter change in material state allows for precise control of gas flow passage cross-sectional areas during molding, enabling uniform gas distribution from multiple injection ports without the variations that occur with post-fabrication cutting processes.
2Object-affected harmful factors
If injection amounts of gas from gas injection ports are increased to reduce reacted film deposition, then deposition is reduced, but the generation of grown film on the substrate is affected
Solution Approach 1:
The patent applies local quality by providing different injection amounts of gas from different gas injection ports located at different positions on the substrate heating surface. Each port can be optimized to inject gas at a specific amount suitable for its local position, preventing reacted film deposition on the outer circumferential portion while maintaining appropriate conditions for grown film generation on the substrate center.
3Ease of manufacture
If gas flow passages are formed by cutting process in fired ceramics, then the heating device structure is established, but process accuracy of the gas flow passages cannot be enhanced and injection amounts of gas cannot be adjusted after fabrication
Solution Approach 1:
The patent performs preliminary action by forming the gas flow passages with precise cross-sectional areas in the green state ceramic base before firing. This preliminary formation of accurate gas flow passages eliminates the need for post-fabrication adjustments, as the desired gas distribution characteristics are built into the structure during the molding stage itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables uniform gas injection from all ports, reducing reacted film deposition on the substrate's outer circumference while maintaining optimal film growth, facilitating easier substrate separation and improving temperature distribution across the heating surface.
Implementation Method 1
a resistance heating body (11) which is embedded in the base (10)
Data Source
AI summary
A heating device is provided, including a ceramic base in which a resistance heating body is embedded, gas flow passages formed in an inside portion of the base, and adjustment members which vary flow rates of a gas provided in the gas flow passages.