Ceramic Heatsink Interface with Phase Change Material
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-current printed circuit board applications face significant challenges in efficient heat removal due to the generation of heat, and existing solutions often require electrically insulating layers between the circuit board and heatsink, which can compromise thermal conductivity.
Innovation Solution
A ceramic support coated with a phase change material is used as an intermediate layer, providing high thermal conductivity and electrical insulation, enriched with fillers for enhanced thermal properties, and mechanically fixed to ensure effective heat dissipation between the printed circuit board and heatsink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electrically insulating layer is provided between the printed circuit board and heatsink, then electrical insulation is ensured, but thermal conductivity deteriorates
Solution Approach 1:
The patent introduces a ceramic carrier as an intermediary component between the printed circuit board and heatsink. This ceramic carrier serves dual functions: it provides electrical insulation to prevent short circuits while simultaneously offering high thermal conductivity to efficiently remove heat from the PCB to the heatsink, thus resolving the contradiction between electrical insulation and heat removal efficiency
Solution Approach 2:
The patent employs composite material structure consisting of a ceramic carrier coated with phase change material. The ceramic base material provides the fundamental electrical insulation and thermal conduction properties, while the phase change material coating enhances thermal contact and heat transfer efficiency, creating a composite structure that optimizes both electrical insulation and thermal management
2Temperature
If copper foil is used for heat removal, then thermal conductivity is improved, but electrical insulation capability deteriorates
Solution Approach 1:
The ceramic carrier acts as a mediator that replaces the need for electrically insulating layers between copper thermal pathways. The copper can be directly integrated into the ceramic carrier structure or connected to it, allowing efficient heat conduction through copper while the ceramic provides the necessary electrical insulation, thus resolving the contradiction between thermal conductivity and electrical insulation capability
3Reliability
If phase change material is used as interface material, then surface wettability is improved, but thermal conductivity may be insufficient without enhancement
Solution Approach 1:
The patent creates a composite interface structure by coating the ceramic carrier with phase change material. The ceramic base provides high thermal conductivity, while the phase change material coating enhances surface wettability and thermal contact between components. This composite approach allows the system to benefit from both the high thermal conductivity of ceramic and the superior surface contact properties of phase change material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation while maintaining electrical insulation, minimizing the risk of mechanical failure and optimizing thermal conductivity, thus addressing the challenge of heat removal in high-current applications.
Implementation Method 1
phase change materials (PCM; also called latent heat materials), which, as interface material, combine low heat resistance with high surface wettability. Phase change materials are wax-like thermal compounds that change phase at a specifically formulated temperature. For example, the phase change material is in the solid phase at room temperature and changes to the liquid phase over and above a temperature of about 50-60° C.
Implementation Method 2
The heat from the components in the printed circuit board element is removed rapidly, for example via a copper foil, into a thick metal carrier connected to the heatsink mass
Implementation Method 3
The thermal conductivity of the phase change material may be increased further by enriching it with fillers such as ceramic (Al2O3, ZrO2, Si3N4, AlN, . . . ), boron nitride, graphite, metal or other thermally conductive fillers
Data Source
AI summary
Printed circuit board module (30) having a printed circuit board (50) and a heatsink (40), and, provided between the printed circuit board (50) and the heatsink (40), a two-dimensional heat-conducting element (10) comprising a ceramic carrier (12) coated with a phase change material (14, 16). In the printed circuit board (50) or the heatsink (40), a through-bore (59) may be provided to accommodate a screw (80) and one end of the screw (86) may mesh into a receiving hole (49) which preferably has a mating thread and is formed in the heatsink (40) or the printed circuit board (50), wherein a screw head (84) of the screw (80) especially has a sprung washer element (90) beneath it.