Multilevel Ceramic Hermetic Package for Heat-Dense Space Electronics
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Solution Overview
Problem
Electronic devices for space applications face challenges in withstanding harsh environmental conditions due to limited heat dissipation through conduction and radiation, and require higher power density and circuitry integration.
Innovation Solution
A multilevel ceramic body structure with ceramic separator structures and plates that form a hermetic package, incorporating semiconductor dies and conductive pads for enhanced thermal management and hermetic sealing, allowing for high power density and circuit integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hermetic package structure is used for space applications, then reliability under harsh environmental conditions is improved, but heat dissipation capability deteriorates due to limited convection
Solution Approach 1:
The package is segmented into multiple hermetic compartments separated by ceramic separator structures, each containing specific semiconductor devices. This segmentation allows optimized thermal paths for each component while maintaining overall hermeticity, addressing both reliability and heat dissipation requirements.
Solution Approach 2:
Ceramic materials serve as intermediary structures that provide both hermetic sealing and thermal conduction pathways. The ceramic body and separator structures act as mediators between the semiconductor devices and the external environment, enabling controlled heat transfer while maintaining hermetic protection.
2Power
If higher power density and circuitry integration are implemented, then functionality and performance are improved, but thermal management difficulty increases
Solution Approach 1:
The package utilizes a three-dimensional multilevel ceramic structure with vertical stacking of semiconductor dies and lateral heat dissipation pathways. This dimensional approach increases integration density while providing multiple thermal escape routes, managing heat from high-power-density circuits effectively.
Solution Approach 2:
Different regions of the ceramic package have optimized properties: areas near high-power devices have enhanced thermal conduction pathways, while other regions maintain hermetic sealing. The ceramic separator structures are strategically positioned to provide local thermal management where needed.
3Reliability
If a multilevel ceramic body with ceramic separator structures is used, then hermetic sealing and thermal management are improved, but device complexity increases
Solution Approach 1:
The ceramic body and separator structures serve multiple functions simultaneously: hermetic sealing, thermal conduction, mechanical support, and electrical isolation. This multi-functionality reduces the need for separate components, managing complexity while maintaining reliability.
Solution Approach 2:
The patent merges sealing, thermal management, and structural support functions into integrated ceramic components. The ceramic separator structures combine hermetic separation with thermal pathway provision, reducing overall device complexity despite the multilevel architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust, hermetically sealed package that facilitates efficient thermal management and high power density, suitable for space applications with integrated circuitry.
Implementation Method 1
A first plate is attached to the first side and covers the first opening, a second plate is attached to the first side and covers the second opening, a third plate is attached to the second side and covers the third opening
Implementation Method 2
packaging solutions are limited to accommodate limitations on heat dissipation due to no thermal convection with only conduction and radiation
Implementation Method 3
Electronic devices operating in space applications must withstand harsh environmental conditions
Data Source
AI summary
An electronic device includes a multilevel ceramic body, first, second, and third plates, and first and second semiconductor dies, with the multilevel ceramic body having opposite first and second sides, a first and second openings in the first side, a third opening in the second side, and a ceramic separator structure defining first and second interior portions between the first and second openings. The first plate is attached to the first side and covers the first opening, the second plate is attached to the first side and covers the second opening, the third plate is attached to the second side and covers the third opening, the first semiconductor die is in the first interior portion, and the second semiconductor die is in the second interior portion of the ceramic body.