Ceramic Sample Holder Sealing for High-Temperature Vacuum Stability
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Solution Overview
Problem
Conventional sample holders used in semiconductor manufacturing devices face challenges in maintaining sealing properties under high-temperature environments, leading to potential vacuum leakage when ceramic substrates and base plates are mechanically bonded without adhesives.
Innovation Solution
A sample holder design that includes a ceramic substrate, a base plate, and a tubular member, with a sealing member between the inner and outer peripheral surfaces of the through hole, and uses mechanical bonding to withstand high temperatures while ensuring sealing through additional sealing members and heat-insulating configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive bonding is used to bond ceramic substrate and base plate, then sealing properties are improved, but heat resistance deteriorates under high-temperature environments
Solution Approach 1:
The invention extracts and removes the adhesive layer from the bonding structure, replacing it with a direct mechanical bonding structure between the ceramic substrate and base plate. This eliminates the adhesive's thermal degradation issue while maintaining sealing through the mechanical bonding structure itself.
Solution Approach 2:
The invention replaces the chemical bonding mechanism (adhesive) with a mechanical bonding mechanism (direct contact and friction between surfaces). This substitution allows the structure to withstand high temperatures since mechanical bonding does not rely on temperature-sensitive chemical bonds.
2Temperature
If mechanical bonding is used to bond ceramic substrate and base plate, then heat resistance is improved, but sealing properties deteriorate leading to vacuum leakage
Solution Approach 1:
The invention introduces a flexible sealing member (such as an O-ring or gasket) into the mechanical bonding structure. This flexible element fills gaps and micro-irregularities between the rigid ceramic substrate and base plate, providing effective sealing while allowing the overall structure to maintain mechanical bonding for heat resistance.
Solution Approach 2:
The invention creates a composite bonding structure that combines rigid mechanical bonding (for heat resistance) with flexible sealing materials (for sealing properties). This composite approach allows both requirements to be satisfied simultaneously by leveraging the strengths of different material types.
3Reliability
If adhesive is used for bonding, then sealing is achieved, but device complexity increases due to additional bonding layers and processes
Solution Approach 1:
The invention removes the adhesive layer and associated bonding processes, simplifying the overall structure. By eliminating the intermediate adhesive layer, the design reduces the number of components, assembly steps, and potential failure points while maintaining sealing through the mechanical bonding structure.
4Reliability
If adhesive bonding is used, then initial sealing is achieved, but durability deteriorates under high-temperature cycling conditions
Solution Approach 1:
The invention replaces temperature-sensitive chemical bonding (adhesive) with temperature-insensitive mechanical bonding. This substitution ensures that the bonding structure maintains its integrity and sealing properties throughout thermal cycling, as mechanical bonds do not degrade in the same way chemical bonds do under repeated heating and cooling.
Solution Approach 2:
The invention changes the bonding mechanism from chemical to mechanical, fundamentally altering how the components are joined. This parameter change makes the bonding structure invariant to temperature variations, ensuring consistent performance across a wide temperature range and extended operational life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces vacuum leakage and maintains sealing properties under high-temperature conditions by using mechanical bonding and strategic sealing members, enhancing reliability and durability.
Implementation Method 1
a sealing member between an inner peripheral surface of the through hole and an outer peripheral surface of the tubular member
Implementation Method 2
uses mechanical bonding to withstand high temperatures while ensuring sealing through additional sealing members and heat-insulating configurations
Data Source
AI summary
A sample holder according to the present disclosure includes a ceramic substrate, a base plate, and a tubular member. The ceramic substrate includes a first surface being a sample holding surface and a second surface located opposite to the first surface. The base plate includes a third surface located on the second surface of the ceramic substrate and facing the second surface, a fourth surface located opposite to the third surface, and a through hole passing through the third surface and the fourth surface. The tubular member is located in the through hole and bonded to the second surface. The sample holder according to the present disclosure includes a sealing member between an inner peripheral surface of the through hole and an outer peripheral surface of the tubular member.