Ceramic Housing Pressure Sensor for Aggressive Media
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Solution Overview
Problem
Existing pressure sensor systems face challenges with long-term resistance in aggressive media and high temperatures due to corrosion and system complexity, particularly with plastic or metal housings, where organic adhesive bonds are weak points and incompatible with alternative joining technologies.
Innovation Solution
A pressure sensor system featuring a ceramic housing body with a monolithically formed, three-dimensionally shaped structure that encapsulates a pressure sensor chip, using ceramic injection-molding technology to produce a housing with adapted thermal expansion coefficients matching the chip, reducing thermomechanical stress and system complexity, and employing suitable ceramic materials like mullite for enhanced media resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If plastic or metal housings are used for pressure sensor systems, then ease of manufacture and cost-effectiveness are improved, but long-term resistance in aggressive media and high temperatures deteriorates due to corrosion and weak adhesive bonds
Solution Approach 1:
The patent changes the material parameter of the housing from plastic or metal to ceramic, which fundamentally alters the chemical and thermal properties. Ceramic material provides resistance to corrosion by aggressive media and stability at high temperatures, directly resolving the reliability issue while maintaining manufacturability through established ceramic injection-molding technologies
Solution Approach 2:
The patent employs ceramic material as a composite solution that combines multiple desirable properties: chemical inertness against aggressive media, thermal stability at high temperatures, mechanical strength, and compatibility with both adhesive and alternative joining technologies. This composite material approach eliminates the trade-off between ease of manufacture and long-term resistance
2Ease of operation
If organic adhesives are used for sealing pressure sensor elements to housings, then ease of assembly is improved, but long-term resistance in aggressive media deteriorates due to corrosion of adhesive bonds
Solution Approach 1:
The patent changes the chemical composition parameter of the adhesive from organic to inorganic (ceramic-based adhesive). This fundamental material parameter change enables the adhesive to resist corrosion by aggressive media while maintaining bonding functionality, thereby improving long-term resistance without sacrificing ease of assembly
Solution Approach 2:
The patent uses ceramic material for both the housing and the adhesive, creating material homogeneity. This ensures that both components have identical chemical resistance properties against aggressive media and similar thermal expansion characteristics, eliminating the weakness of dissimilar material interfaces and improving long-term reliability
3Ease of manufacture
If plastic housings are used for pressure sensor systems, then cost-effectiveness is improved, but compatibility with alternative joining technologies such as welds and soldered connections deteriorates
Solution Approach 1:
The patent employs ceramic material for the housing that serves multiple functions and is compatible with multiple joining technologies. The ceramic housing can be effectively joined using adhesives, welds, or soldered connections, providing versatility in manufacturing choices while maintaining cost-effectiveness through standardized ceramic processing techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic encapsulated pressure sensor system achieves improved media resistance, reduced thermomechanical stress, and cost savings by simplifying the system design, enabling use in aggressive media and high temperatures while maintaining mechanical robustness and stability.
Implementation Method 1
The housing body is produced from a ceramic material... improved media resistance... enabling use in aggressive media
Implementation Method 2
the ceramic material of the housing body has a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip... reducing thermomechanical stress
Data Source
AI summary
A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.