Ceramic Image Sensor Package with Integrated Infrared Filter
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Solution Overview
Problem
Conventional ceramic packages for image sensors are bulky due to the inclusion of IR filters on upper and lower surfaces, complicating the manufacturing process and increasing the component height, which is undesirable for miniaturization in digital products.
Innovation Solution
An image sensor design featuring a ceramic base with a cavity, a conductive sidewall protrusion, and a sealing ring, where the IR filter is positioned on the protrusion and the image unit is supported by the lower surface, creating a sealed cavity with an adhesive layer for enhanced electrical connection and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If IR filters are placed on upper and lower surfaces of ceramic base, then image sensor functionality is improved, but component height increases and manufacturing complexity increases
Solution Approach 1:
The patent repositions the IR filter from a traditional surface-mounted location to an integrated position within the ceramic base structure itself. The filter is formed as part of the ceramic base in the cavity region, transitioning from a separate surface component to an integrated three-dimensional structure, thereby reducing overall component height while maintaining filtering functionality.
Solution Approach 2:
The patent combines the IR filter with the ceramic base into a single integrated structure. The filter and ceramic base are formed simultaneously or pre-integrated, eliminating the need for separate mounting steps and reducing the overall component height by merging two previously separate elements into one unified structure.
2Reliability
If IR filters are placed on upper and lower surfaces of ceramic base, then image sensor functionality is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent merges the IR filter formation process with the ceramic base manufacturing process. The filter is formed within the cavity of the ceramic base during the same manufacturing cycle, eliminating separate filter mounting, alignment, and bonding steps, thereby simplifying the overall manufacturing process.
Solution Approach 2:
The IR filter is pre-formed within the ceramic base structure during manufacturing, before final assembly. This preliminary integration of the filter into the ceramic base eliminates subsequent assembly steps and reduces manufacturing complexity by preparing the filter position in advance as part of the base structure.
3Reliability
If multiple separate components are used for IR filter and image unit, then functional requirements are met, but overall package size increases
Solution Approach 1:
The patent nests the image unit within the cavity of the ceramic base, with the IR filter positioned above the cavity opening. This nested arrangement allows the image unit to be housed within the three-dimensional space of the ceramic base rather than requiring separate planar mounting space, thereby reducing the overall package footprint and volume.
Solution Approach 2:
The patent utilizes the vertical dimension of the ceramic base cavity to house the image unit, transitioning from a planar two-dimensional layout to a three-dimensional vertical stacking arrangement. This dimensional change allows compact integration of multiple components within a smaller overall package volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the overall size of the ceramic package by integrating the IR filter and image unit within the ceramic base, simplifying the manufacturing process and enhancing electrical connectivity while maintaining thermal conduction and insulation properties.
Implementation Method 1
an adhesive layer between the image unit and the lower surface of the protrusion
Implementation Method 2
Ceramic is a widely used packaging material for packaging electrical components by virtue of its high thermal conduction
Implementation Method 3
Ceramic is a widely used packaging material for packaging electrical components by virtue of its high thermal conduction and excellent insulating property
Data Source
AI summary
An image sensor includes a ceramic base with a cavity therein, the ceramic base including a sidewall forming a conductive layer embedded therein. A protrusion extends from the sidewall toward the center of the cavity. An infrared filter is mounted on the upper surface of the protrusion with a most upper surface of the infrared filter not higher than the upper surface of the ceramic base; and an image unit is mounted on the lower surface of the protrusion with a most lower surface not lower than the lower surface of the ceramic base.