Ceramic Inertial Sensor Housing for Thermal Alignment Stability
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Solution Overview
Problem
Existing inertial sensor systems face challenges in maintaining high position and alignment accuracy under varying environmental conditions due to mechanical stresses from differing thermal expansion coefficients of materials, leading to measurement errors and potential leaks.
Innovation Solution
A method involving additive manufacturing with a ceramic suspension, followed by thermal treatment, to create a hermetically sealed housing with aligned sensor units, using the same ceramic material for all components and electrical conductor tracks, ensuring precise alignment and environmental protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sensors are mounted on circuit boards with different materials, then assembly is simplified, but mechanical stresses from thermal expansion differences cause deformation and measurement errors
Solution Approach 1:
The patent applies homogeneity by using the same ceramic material for both the housing and circuit board substrate. This eliminates thermal expansion coefficient differences between materials, preventing mechanical stresses and deformation during temperature changes, thereby maintaining sensor alignment accuracy while allowing simplified assembly procedures
2Ease of manufacture
If sensors are mounted on circuit boards, then electrical connections are facilitated, but hermetic sealing becomes difficult and environmental penetration occurs
Solution Approach 1:
The patent uses composite materials by integrating conductive paste layers within the ceramic housing structure itself. The ceramic material serves dual functions as both structural housing and electrical connection medium, eliminating the need for separate circuit board assemblies and enabling complete hermetic sealing while maintaining electrical connectivity
3Measurement precision
If precise sensor alignment is achieved during assembly, then measurement accuracy is improved, but alignment must be continuously maintained under thermal stress
Solution Approach 1:
The patent ensures alignment stability by using homogeneous ceramic material throughout the housing and substrate. This eliminates differential thermal expansion that would otherwise cause deformation and misalignment during temperature changes, allowing precise sensor alignment to be maintained continuously without drift
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains precise sensor alignment and prevents environmental penetration, reducing mechanical stresses and measurement errors, enabling accurate operation across diverse conditions.
Implementation Method 1
a polymer curable under the influence of electromagnetic radiation, heat or cooling
Implementation Method 2
thermal decomposition of at least almost all of the organic components contained
Implementation Method 3
subsequent sintering of the ceramic powder material
Implementation Method 4
subsequent sintering of the electrically conductive particles to form electrical conductors
Data Source
Figure 1~2
Figure 3
AI summary
The sensor system consists of a hermetically sealed housing comprising a base plate (1), a support structure (2) arranged inside the housing, and a cover element (3), which are made of the same ceramic material. One or more sensor units are arranged on each of several walls of the support structure (2), the base plate (1), and/or the cover element (3). The cover element (3) is hermetically connected to the base plate (1) and/or the support structure (2) by a material-to-material connection. Walls of the support structure (2) are arranged inside the housing, on which at least one sensor unit is arranged, and which are each aligned at predetermined angles to one another with a maximum angular deviation of 2°, preferably a maximum of 1°. They have a flat, planar surface. The sensor units are electrically connected to one another and to the outside by means of electrical conductor tracks.