Ceramic Insert Circuit Package for Solder Junction Heat Dissipation
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Solution Overview
Problem
Large power amplifiers in communication and radar systems face degradation and failure due to inadequate heat management during sustained high-power operation, leading to thermal issues and potential short circuits or open circuits at solder junctions.
Innovation Solution
A ceramic insert is integrated into the package to provide an enhanced thermal path for heat dissipation, replacing traditional laminate ringframes and acting as a heat sink to prevent heat accumulation at solder junctions, thereby improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional laminate ringframes are used for heat management, then the package structure is simpler and easier to manufacture, but heat dissipation is insufficient leading to thermal accumulation at solder junctions
Solution Approach 1:
The patent uses a ceramic insert material that combines high thermal conductivity with electrical insulation properties. This composite material approach allows the heat management component to simultaneously conduct heat away from solder junctions while preventing electrical short circuits, resolving the contradiction between improving heat dissipation and maintaining structural simplicity.
Solution Approach 2:
The ceramic insert acts as an intermediary component between the heat-generating circuitry and the heat sink. It mediates the thermal transfer process by providing a dedicated thermal pathway that does not interfere with the electrical connections, thereby improving heat dissipation without complicating the electrical architecture.
2Power
If high power operation is sustained, then the output power level is maintained, but thermal degradation and failure of the package occur
Solution Approach 1:
The patent extracts the heat management function from the traditional laminate structure and implements it as a separate ceramic insert component. This extraction allows the heat dissipation pathway to be optimized independently from the electrical circuitry, enabling sustained high power operation without compromising package reliability due to thermal accumulation.
Solution Approach 2:
The ceramic insert provides beforehand cushioning against thermal degradation by preemptively conducting heat away from critical solder junctions before thermal damage can occur. This preventive heat management protects the package integrity during sustained high-power operation, maintaining reliability under extreme conditions.
3Temperature
If heat accumulates at solder junctions, then the thermal path is insufficient, but adding more thermal pathways increases device complexity
Solution Approach 1:
The ceramic insert performs multiple functions simultaneously: it conducts heat away from solder junctions, provides electrical insulation to prevent short circuits, and maintains mechanical support for the circuit board. This multi-functionality allows effective heat transfer without increasing device complexity, as a single component addresses multiple thermal and electrical requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic insert effectively transfers and dissipates heat, preventing damage to solder junctions and ensuring reliable operation at high power levels and frequencies, reducing the risk of thermal-related failures.
Implementation Method 1
The ceramic insert more readily transfers and/or dissipates heat that might otherwise accumulate at an output port where a solder junction may be made to couple the output port to external elements
Data Source
AI summary
A circuit package with improved thermal management is disclosed. In one aspect, a ceramic insert is provided within a package having heat-producing circuitry thereon. The ceramic insert replaces traditional laminate inserts and provides a better thermal path to remove heat from leads and/or traces within the package. More particularly, the ceramic insert more readily transfers and/or dissipates heat that might otherwise accumulate at an output port where a solder junction may be made to couple the output port to external elements.